參數(shù)資料
型號: 24AA52_05
廠商: Microchip Technology Inc.
元件分類: EEPROM
英文描述: 2K 2.2V I2C⑩ Serial EEPROM with Software Write-Protect
中文描述: ⑩2K 2.2伏的I2C串行EEPROM與軟件寫保護(hù)
文件頁數(shù): 20/28頁
文件大?。?/td> 350K
代理商: 24AA52_05
24AA52/24LCS52
DS21166J-page 20
2005 Microchip Technology Inc.
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
L
E2
A3
A1
A
TOP VIEW
D
E
EXPOSED
METAL
PAD
D2
BOTTOM VIEW
2
1
b
p
n
(
NOTE 3
)
ETIE BAR
PIN 1
(
NOTE 1
)
ID IAREA
(
NOTE 2
)
CONFIGURATION
CONTACT
ALTERNATE
DETAIL
K
3.
Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent MO-229 VCED-2
DWG No. C04-123
MILLIMETERS
*
NOM
0.50 BSC
2.00 BSC
3.00 BSC
0.20 REF.
1.
Pin 1 visual index feature may vary, but must be located within the hatched area.
2.
Exposed pad may vary according to die attach paddle size.
.039
.002
.035
.001
.031
.000
0.80
0.00
A
A1
Overall Height
Standoff
Contact Thickness
*
Controlling Parameter
**
Not within JEDEC parameters
§
Significant Characteristic
Contact Length §
Contact-to-Exposed Pad
Notes:
Contact Width
Overall Width
Exposed Pad Length
Overall Length
Exposed Pad Width
.010
.008
L
K
b
.012
0.20
.008 REF.
.079 BSC
.118 BSC
D
E
.051
.059
.012
.008
D2
E2
A3
.069
.075
.020
1.30
**
1.50
**
0.30
0.20
Dimension Limits
Pitch
Number of Pins
INCHES
NOM
.020 BSC
MIN
n
e
Units
8
MAX
MIN
1.00
0.05
0.90
0.02
0.25
0.30
1.75
1.90
0.50
8
MAX
§
.016
0.40
Revised 09-12-05
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