Chip Scale Packaging Options
* Densities greater than 32 Mb may use additional balls for stability.
Packaging Options
Socket Vendors
Package
KGD
(Known Good Die)
http://www.amd.com/
flash/kgd
Features
Benefits
Existing AMD Flash fully tested at temperature and
speed.
Same quality and reliability as packaged devices.
Both 5.0 Volt-only and 3.0 Volt-only products in x8 or
x8/x16 configuration.
A small form factor ideal for use in multi-
chip modules or hybrids.
Fits small form-factor applications.
Fine-Pitch
Ball Grid Array
Fortified
Ball Grid Array
http://www.amd.com/
flash/bga
Chip-scale packages.
Fine pitch BGA has 0.8 mm pitch; Fortified BGA has
1.0 mm pitch
Same input/output ball footprint for a variety of
densities, regardless of package size.*
No manufacturing or handling equipment changes
required if the die size is changed.
FBGA chip-scale packaging requires only
about 1/3 the board space of the TSOP
package for densities up to 16 Mb.
No board layout changes required to
migrate to a higher or lower density
memory.*
Lowest cost chip-scale package.
PDIP
SO
TSOP
PLCC
KGD (16Mb)
FBGA (16Mb)
For more information on sockets, contact the following vendors:
Yamaichi Electronics
2235 Zanker Road
San Jose, CA 95131
(408) 456-0797 Fax (408) 456-0799
Wells Electronics, Inc.
226 Airport Parkway, Suite 300
San Jose, CA 95110
(408) 452-4290 Fax (408) 452-4291
Loranger Intl. Corp.
3000 Scott Boulevard, Suite 201
San Clara, CA 95054
(408) 727-4234 Fax (408) 727-5842
email: loranger@inow.com
AMD Flash Memory Web Site Contents
Go to http://www.amd.com/flash.
The AMD web site contains a wealth of information relating to AMD Flash memory. The Flash memory portion of the
site is divided into three subsections: Product Information, Flash Applications, and Technical Resources, and can
be accessed from the tabs on the main horizontal menu. Each subsection has its own hub page and menu from
which information is easily found. The
Product Information
section allows navigation to individual products by
choosing an operating voltage, architecture, or density. The individual product pages have direct links to application
notes, and software simulation models. The
Flash Applications
section leads to information on four market
segments that have a significant number of Flash memory applications. A link to reference designs that feature
AMD Flash is also provided. The
Technical Resources
section contains data sheets, application notes, white
papers, Flash memory-specific software, and information on AMD programming services. Supporting
documentation on packaging and Known Good Die (KGD) products are also available. Information on obsolete
products such as EPROMs and 12 V Flash is archived within this section.
The following table highlights some of the web site features that are currently available.
Subject
Description
Link from Flash Memory Home Page
Go to http://www.amd.com/flash
MirrorBit
An entire section devoted to MirrorBit
products and technology: data sheets, white
paper, multimedia demo, application notes,
and software simulation models.
http://www.amd.com/flash/mirrorbit
FusionFlash Catalog
A collection of web pages describing
companies that work with AMD to support
AMD Flash memory products. Some areas of
support include sockets, programming
equipment, and software.
Click on “Third Party Support.” Then click on the
desired topic link.
Technical
Documentation
A list of online publications in PDF format that
includes data sheets, application notes,
technical backgrounds, and other general
information pieces. Viewing and printing
PDFs require Adobe Acrobat Reader.
http://www.amd.com/flash/docs
Data Sheet
Programmer
Supplements
Documents in PDF format that describe, for
Flash devices that lack in-system sector
protection and unprotection capability, the
algorithms that must be performed using
external programming equipment.
Requires contacting AMD or an AMD representative
for access.
Applications-focused
Web Pages
Web pages designed to explain the features
and benefits of AMD Flash memory that are
ideal for a specific market segment.
Examples of segments include portable,
networking/telecommunications, and
automotive applications.
http://www.amd.com/flash/applications
Flash Memory
Device Drivers
Source code for integration into customer
code that handles the operation of the Flash
device. Two types of drivers are available: a
basic version that controls the operation of
the Flash—read, erase, program; the other
version controls the Flash device and
additionally queries CFI-capable (Common
Flash Interface) Flash for device information
http://www.amd.com/flash/drivers
CAD Models
Files that include parameters and
specifications describing AMD Flash
memory. Files are intended for use with
circuit design simulation software.
http://www.amd.com/flash/models
2
17
A
Q