參數(shù)資料
型號： 046001.5TX832
英文描述： FUSE SMD 1.5A SLOW
中文描述： 貼片保險絲1.5A的慢
文件頁數(shù)： 1/1頁
文件大?。?/td> 69K
代理商： 046001.5TX832
37
SURFACE MOUNT FUSES
SUBMINIATURE SURFACE MOUNT
PICO
SMF Slo-Blo Type Fuse 460 Series
The PICO SMF Slo-Blo Fuse product provides Pico fuse
reliability and performance in a standard rectangular sur-
face mount package.
ELECTRICAL CHARACTERISTICS:
% of Ampere
Opening
Rating
Time
100%
4 hours, Minimum
200%
1 second, Min.; 120 seconds, Max.
300%
0.2 second, Min.; 3 seconds, Max.
800%
0.02 second, Min.; 0.1 second, Max.
AGENCY APPROVALS: Recognized under the
Components Program of Underwriters Laboratories and
Certified by CSA. Approved by MITI from 1 through 5
amperes.
AGENCY FILE NUMBERS: UL E10480, CSA LR 29862.
INTERRUPTING RATINGS:
50 amperes at 125 VAC.
50 amperes at 125 VDC.
ENVIRONMENTAL SPECIFICATIONS:
Operating Temperature: –55°C to 125°C.
Shock: MIL-STD-202, Method 213, Test Condition I
(100 G’s peak for 6 milliseconds).
Vibration: MIL-STD-202, Method 201 (10–55 Hz).
MIL-STD-202, Method 204, Test Condition C (55 –2000 Hz,
10 G’s peak).
Salt Spray: MIL-STD-202, Method 101, Test Condition B.
Insulation Resistance (After Opening): MIL-STD-202,
Method 302, (10,000 ohms minimum at 100 volts).
Resistance to Soldering Heat: MIL-STD-202,
Method 210, (3 sec. at 260°C).
Thermal Shock: MIL-STD-202, Method 107,
(–65 to 125°C).
Moisture Resistance: MIL-STD-202, Method 106, High
Humidity (90-98 RH), Heat (65°C).
PHYSICAL SPECIFICATIONS:
Materials: Body: Molded Thermoplastic
Terminations: Tin-Lead Plated Copper
Soldering Parameters:
Wave Solder — 260°C, 3 seconds maximum
Reflow Solder — 230°C, 30 seconds maximum
Solderability: MIL-STD-202, Method 208.
PACKAGING SPECIFICATIONS: 12mm Tape and Reel
per EIA-RS481 (IEC 286, part 3); 500 per reel, add
packaging suffix, UR.
PATENTED
ORDERING INFORMATION:
1000
100
10
1
0.1
0.01
10
CURRENT IN AMPERES
TIME
IN
SECONDS
100
1000
0.1
1
0.05
5.0A
4.0A
3.5A
3.0A
2.5A
2.0A
1.5A
1.0A
.750A
.500A
Nominal
Catalog
Ampere
Voltage
Resistance
Melting I
2t
Number
Rating
Cold Ohms
A
2 Sec.
R460.500
1/2
125
1.19
0.210
R460.750
3/4
125
0.497
0.760
R460 001
1
125
0.280
2.01
R460 01.5
11/2
125
0.116
3.94
R460 002
2
125
0.071
7.60
R460 02.5
21/2
125
0.052
13.0
R460 003
3
125
0.038
21.0
R460 03.5
31/2
125
0.024
26.8
R460 004
4
125
0.0194
35.0
R460 005
5
125
0.0133
54.8
Average Time Current Curves
T
.170"
5 A
1 25 V
LF
4 60
B 3
.120"
.117"
.285"
REF.
.051"
REF.
.080"
.325"
.065"
.195"
RECOMMENDED
PAD LAYOUT
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
046002.5 制造商:LITTELFUSE 制造商全稱:Littelfuse 功能描述:Surface Mount Fuses
046002.5ER 功能描述:保險絲 125V 2.5A Slo-Blo RoHS:否 制造商:Littelfuse 產(chǎn)品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險絲類型:Fast Acting 保險絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風(fēng)格: 端接類型:SMD/SMT 系列:485
046002.5UR 功能描述:保險絲 125V 2.5A Slo-Blo RoHS:否 制造商:Littelfuse 產(chǎn)品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險絲類型:Fast Acting 保險絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風(fēng)格: 端接類型:SMD/SMT 系列:485
04-600-20 功能描述:IC 與器件插座 HEADER 4 PINS COINED CONTACT RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
04-600-21 功能描述:IC 與器件插座 HEADER 4 PINS COINED CONTACT RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C
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