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參數(shù)資料
| 型號： | μPC8105GR |
| 廠商： | NEC Corp. |
| 英文描述： | Modulator For Digital Mobile Communication Systems.(應用于數(shù)字移動通信的調(diào)節(jié)器) |
| 中文描述： | 調(diào)制器，用于數(shù)字移動通信系統(tǒng)。（應用于數(shù)字移動通信的調(diào)節(jié)器） |
| 文件頁數(shù)： | 14/16頁 |
| 文件大?。?/td> | 129K |
| 代理商： | ΜPC8105GR |
Data Sheet P10807EJ3V0DS00
14
μ
PC8105GR
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the V
CC
pin.
(5) I, Q DC offset voltage should be same as the I, Q DC offset voltage (to prevent changing the local leak level with
power save control.)
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
μ
PC8105GR
Soldering process
Soldering Conditions
Symbol
Infrared ray reflow
Peak package’s surface temperature: 235
°
C or below,
Reflow time: 30 seconds or below (210
°
C or higher),
Number of reflow process: 3, Exposure limit
*
: None
IR35-00-3
VPS
Peak package’s surface temperature: 215
°
C or below,
Reflow time: 30 seconds or below (200
°
C or higher),
Number of reflow process: 3, Exposure limit
*
: None
VP15-00-3
Wave soldering
Solder temperature: 260
°
C or below
Flow time: 10 seconds or below,
Number of reflow process: 1, Exposure limit
*
: None
WS60-00-1
Partial heating method
Terminal temperature: 300
°
C or below
Flow time: 3 seconds/pin or below,
Exposure limit
*
: None
*:
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25
°
C and relative humidity at 65 % or less.
Note:
Apply only a single process at once, except for “Partial heating method”.
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
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