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參數(shù)資料
| 型號(hào)： | ZSP4422A |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | Electroluminescent Lamp Driver |
| 中文描述： | 電致發(fā)光燈驅(qū)動(dòng)器 |
| 文件頁(yè)數(shù)： | 3/8頁(yè) |
| 文件大?。?/td> | 154K |
| 代理商： | ZSP4422A |
3
March 2004
rev. 01
Zywyn Corporation
ZSP4422A
Zywyn
Block Diagram
Figure 1. Block Diagram
Pin Description
Pin Number
Pin Name
Pin Function
1
HON
Enable for driver operation: high = active; low = inactive.
2
V
SS
COIL
Power supply common: connect to ground.
3
Coil input: connect coil from V
DD
to this pin.
Lamp driver output 2: connect to EL lamp.
4
EL2
5
EL1
Lamp driver output 1: connect to EL lamp.
6
V
DD
CAP1
Power supply for driver: connect to system V
DD
.
Capacitor Input 1: connect to C
OSC
.
Capacitor Input 2: connect to C
OSC
.
7
8
CAP2
Bonding Diagram
Die Photo
Q
Q
V
BATTERY
HON
V
DD
FF1
FF2
EL Lamp
4
V
DD
7
Coil
2
3
EL2
EL1
5
6
V
SS
5mH/18
1
OSC
Cap1
C
OSC
= 100pF
f
COIL
f
LAMP
f
LAMP
HV
1
HV
2
Cap2
8
0.1
μ
F
C O IL
V
V
E L1
E L2
CAP 1
CAP
2
H O N
Z S P 4 4 2 2 A
D D
S S
P A D
E L 1
E L 2
X
Y
5 5 6 .5
5 5 6 .2
1 7 9 .0
-1 5 1 .0
C O IL
V
S S
-1 9 .5
-5 6 8 .0
-5 1 7 .0
-5 1 7 .0
H O N
C A P 2
C A P 1
V
D D
-5 4 9 .0
-5 4 9 .0
-5 6 8 .0
-2 5 6 .5
9 3 .5
-5 1 6 .5
N O T E S :
1. Dimensions a re in microns unless othe rwise noted.
2. Bonding pads a re 125x125 typical
3. Outside dimensions a re maximum , including scribe are
a.
4. Die thickness is 11 mils +/- 1.
5. Pad center coordinates are relative to die center.
6. Die substrate down-bonds to Vss (GND)
7. Die mask number is MS129.
8. Die size 1346 x 1447 ( 53 x 57 mils)
-3 4 9 .0
5 1 7 .0
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