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CYStech Electronics Corp.
Spec. No. : C326N3
Issued Date : 2003.04.14
Revised Date :
Page No. : 12/12
SOT-23 Dimension
ZD52XXBN3 series
CYStek Product Specification
*: Typical
Inches
Millimeters
Min.
2.80
1.20
0.89
0.30
1.70
0.013
Inches
Millimeters
Min.
0.085
0.32
0.85
2.10
0.25
DIM
Min.
0.1102
0.0472
0.0335
0.0118
0.0669
0.0005
Max.
0.1204
0.0630
0.0512
0.0197
0.0910
0.0040
Max.
3.04
1.60
1.30
0.50
2.30
0.10
DIM
Min.
0.0034
0.0128
0.0335
0.0830
0.0098
Max.
0.0070
0.0266
0.0453
0.1083
0.0256
Max.
0.177
0.67
1.15
2.75
0.65
A
B
C
D
G
H
J
K
L
S
V
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: 42 Alloy ; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
H
J
K
D
A
L
G
V
C
B
3
2
1
S
Style: Pin 1.Anode 2.NC 3.Cathode
Marking:
3-Lead SOT-23 Plastic
Surface Mounted Package
CYStek Package Code: N3
XXX
Diagram: