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參數(shù)資料
| 型號(hào)： | Z5.067A |
| 廠商： | Intersil Corporation |
| 英文描述： | Plastic Packages for Integrated Circuits |
| 中文描述： | 集成電路塑料封裝 |
| 文件頁數(shù)： | 1/1頁 |
| 文件大?。?/td> | 29K |
| 代理商： | Z5.067A |
1
Plastic Packages for Integrated Circuits
Single-In-Line Plastic Packages (SIP)
E
L2
D
-C-
L
D1
E1
-A-
BACK VIEW
LAND PATTERN
C2
A
0.006
(0.15)
-B-
0.00 - 0.0098
(0.00 - 0.25)
L1
HEATSLUG
PLANE
b
0.010 (0.25)
B
A
M
M
C M
e
PIN
#1
0.350
(8.89)
MIN
0.609
(15.46)
MIN
0.450
(11.43)MIN
e
0.129
(3.27)
TYP
0.043
(1.09)
TYP
c
0.004
(0.10)
0
o
- 8
o
L3
Z5.067A
5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE SURFACE MOUNT
“GULLWING” LEAD FORM
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.170
0.180
4.32
4.57
-
C2
0.048
0.055
1.22
1.39
5
D
0.350
0.370
8.89
9.39
-
E
0.395
0.405
10.04
10.28
-
D1
0.310
-
7.88
-
-
E1
0.310
-
7.88
-
-
L
0.549
0.569
13.95
14.45
-
L1
0.068
0.088
1.72
2.24
-
L2
0.045
0.055
1.15
1.40
-
L3
0.030 BSC
0.76 BSC
4
b
0.028
0.037
0.71
0.94
5, 6, 7
c
0.018
0.024
0.46
0.60
5
e
0.067 BSC
1.70 BSC
-
Rev. 3 4/03
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-169AB, Issue A.
2. Controlling dimension: Inch.
3. Dimensioning and tolerance per ANSI Y14.5M-1982.
4. Gauge plane L3 is parallel to heatslug plane.
5. Dimensions include lead finish.
6. Leads are not allowed above the datum
7. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed the
maximum “b” by more than 0.003’’ (0.08mm).
.
-B-
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