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參數(shù)資料
| 型號(hào)： | YNV12T16-DG |
| 廠商： | POWER-ONE INC |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT DC-DC REG PWR SUPPLY MODULE |
| 封裝： | ROHS COMPLIANT, SIP-10 |
| 文件頁數(shù)： | 1/28頁 |
| 文件大?。?/td> | 449K |
| 代理商： | YNV12T16-DG |
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ZD-02039 Rev. 3.1
Page 1 of 28
www.power-one.com
YNV12T16 DC-DC Converter Data Sheet
9.6-14 VDC Input; 0.7525-5.5 VDC Programmable @ 16 A
Applications
Intermediate Bus Architectures
Telecommunications
Data communications
Distributed Power Architectures
Servers, workstations
Benefits
High efficiency – no heat sink required
Reduces total solution board area
Minimizes part numbers in inventory
The
Products: Y-Series
Features
RoHS lead-free solder and lead-solder-exempted
products are available
Delivers up to 16 A (88 W)
Extended input range 9.6 V – 14 V
Industry-standard footprint and pinout
Single-in-Line Package (SIP): 2.0” x 0.535” x 0.28”
(50.8 x 13.59 x 7.11 mm)
Weight: 0.25 oz [7 g]
Synchronous Buck Converter Topology
Start-up into pre-biased output
No minimum load required
Programmable output voltage via external resistor
Operating ambient temperature: -40 °C to 85 °C
Remote output sense
Remote ON/OFF (Positive or Negative)
Fixed-frequency operation
Auto-reset output overcurrent protection
Auto-reset overtemperature protection
High reliability, MTBF = TBD Million Hours
All materials meet UL94, V-0 flammability rating
UL 60950 recognition in U.S. & Canada, and DEMKO
certification per IEC/EN 60950
Description
YNV12T16 non-isolated DC-DC converters deliver up to 16 A of output current in an industry-standard,
through-hole (SIP) package. They operate from a 9.6 to 14 VDC input and are ideal choices for Intermediate
Bus Architectures where point-of-load power delivery is generally a requirement. In addition, they provide a
resistor-programmable regulated output voltage of 0.7525 V to 5.5 V.
The Y Series of non-isolated DC-DC converters provides exceptional thermal performance, even in high
temperature environments with minimal airflow. This is accomplished through the use of circuit, packaging
and processing techniques to achieve ultra-high efficiency, excellent thermal management and a very sleek
body profile.
The low body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.
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