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參數(shù)資料
| 型號(hào)： | YNM05S06-G |
| 廠商： | POWER-ONE INC |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT DC-DC REG PWR SUPPLY MODULE |
| 文件頁數(shù)： | 1/25頁 |
| 文件大?。?/td> | 410K |
| 代理商： | YNM05S06-G |
Data Sheet
3.0 - 5.5Vdc Input; 6A, 0.7525 - 3.63Vdc Programmable Output
Rev 1 08-25-04
WWW.POWER-ONE.COM
Page 1 of 25
di/dt
Nex
TM
-m Series: YNM05S06
Applications
Intermediate Bus Architectures
Telecommunications
Data Communications
Distributed Power Architectures
Servers, Workstations
Benefits
High efficiency – no heatsink required
Reduces Total Solution Board Area
Tape and Reel packing
Compatible with Pick & Place Equipment
Minimizes Part Numbers in Inventory
THE
PRODUCTS: Nex
TM FAMILY
Features
Delivers up to 6A (20W)
No derating up to 85°C
Surface-Mount package
Industry-standard footprint and pinout
Small size and low profile: 0.80” x 0.45” x 0.247”
(20.32mm x 11.43mm x 6.27mm)
Weight: 0.08 oz [2.22 g]
Coplanarity less than 0.003”, maximum
Synchronous Buck Converter Topology
Start up into pre-biased output
No minimum load required
Programmable output voltage via external resistor
Operating ambient temperature: -40°C to 85°C
Remote ON/OFF
Fixed frequency operation
Auto-reset output over-current protection
Auto-reset over-temperature protection
High reliability, MTBF = TBD
All materials meet UL94, V-0 flammability rating
UL 60950 recognition in U.S. & Canada, and DEMKO
certification per IEC/EN 60950 (pending)
Description
The Nex
TM
-m Series of non-isolated DC/DC converters deliver up to 6A of output current in an industry-
standard surface-mount package. Operating from a 3.0Vdc–5.5Vdc input, these converters are ideal choices
for Intermediate Bus Architectures where Point-of-Load power delivery is generally a requirement. They
provide an extremely tight regulated programmable output voltage from 0.7525V to 3.63V.
The Nex
TM
-m Series of converters provide exceptional thermal performance, even in high temperature
environments with minimal airflow. No derating is needed up to 85
°C and zero airflow. This is accomplished
through the use of advanced circuitry, packaging and processing techniques to achieve a design possessing
ultra-high efficiency, excellent thermal management and a very low body profile.
The low body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.
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