NOTES: 1. When Dual-Rail" />
參數(shù)資料
型號： XRT75R03DIVTR
廠商： Exar Corporation
文件頁數(shù)： 78/135頁
文件大?。?/td> 0K
描述： IC LIU E3/DS3/STS-1 3CH 128LQFP
標準包裝： 750
類型： 線路接口裝置（LIU）
驅動器/接收器數(shù)： 3/3
規(guī)程： DS3，E3，STS-1
電源電壓： 3.135 V ~ 3.465 V
安裝類型： 表面貼裝
封裝/外殼： 128-LQFP
供應商設備封裝： 128-LQFP（14x20）
包裝： 帶卷 (TR)
XRT75R03D
43
REV. 1.0.4
THREE CHANNEL E3/DS3/STS-1 LINE
NOTES:
1.
When Dual-Rail data format is selected, the B3ZS/HDB3 Encoder is automatically disabled.
2.
In Dual-Rail format, the Bipolar Violations in the incoming data stream is converted to valid data pulses.
3.
Encoder and Decoder is enabled only in Single-Rail mode.
5.3
TRANSMIT PULSE SHAPER:
The Transmit Pulse Shaper converts the B3ZS encoded digital pulses into a single analog Alternate Mark
Inversion (AMI) pulse that meet the industry standard mask template requirements for STS-1 and DS3. See
Figures 8 and 9.
For E3 mode, the pulse shaper converts the HDB3 encoded pulses into a single full amplitude square shaped
pulse with very little slope. This is illustrated in Figure 7.
The Pulse Shaper Block also includes a Transmit Build Out Circuit, which can either be disabled or enabled by
setting the TxLEV_n input pin “High” or “Low” (in Hardware Mode) or setting the TxLEV_n bit to “1” or “0” in the
control register (in Host Mode).
For DS3/STS-1 rates, the Transmit Build Out Circuit is used to shape the transmit waveform that ensures that
transmit pulse template requirements are met at the Cross-Connect system. The distance between the
transmitter output and the Cross-Connect system can be between 0 to 450 feet.
For E3 rate, since the output pulse template is measured at the secondary of the transformer and since there is
no Cross-Connect system pulse template requirements, the Transmit Build Out Circuit is always disabled.
5.3.1
Guidelines for using Transmit Build Out Circuit:
If the distance between the transmitter and the DSX3 or STSX-1, Cross-Connect system, is less than 225 feet,
enable the Transmit Build Out Circuit by setting the TxLEV_n input pin “Low” (in Hardware Mode) or setting the
TxLEV_n control bit to “0” (in Host Mode).
If the distance between the transmitter and the DSX3 or STSX-1 is greater than 225 feet, disable the Transmit
Build Out Circuit.
5.3.2
Interfacing to the line:
The differential line driver increases the transmit waveform to appropriate level and drives into the 75
load as
shown in Figure 6.
相關PDF資料
PDF描述
VI-21V-MX-F2 CONVERTER MOD DC/DC 5.8V 75W
XRT75L02IVTR-F IC LIU E3/DS3/STS-1 2CH 100TQFP
IDT723631L20PFI8 IC FIFO SYNC 512X36 120-TQFP
ISL26313FBZ IC ADC 12BIT SPI/SRL 125K 8SOIC
IDT723643L15PF8 IC FIFO SYNC 1024X36 128QFP
相關代理商/技術參數(shù)
參數(shù)描述
XRT75R03DIVTR-F 功能描述:接口 - 專用 RoHS:否 制造商:Texas Instruments 產品類型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:BGA-59
XRT75R03ES 功能描述:時鐘合成器/抖動清除器 3CH T3/E3/STS1LIU+JA 3.3V W/REDUNDANCY RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel
XRT75R03IV 功能描述:外圍驅動器與原件 - PCI 3CHNNEL E3/DS3/STS 1 JITTER ATTENUATOR RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray
XRT75R03IV-F 功能描述:外圍驅動器與原件 - PCI 3-Ch E3/DS3/STS-1 RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray
XRT75R03IVTR 功能描述:時鐘合成器/抖動清除器 3CHNNEL E3/DS3/STS 1 JITTER ATTENUATOR RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel
發(fā)布緊急采購，3分鐘左右您將得到回復。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*