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參數資料
| 型號： | XR16M670IL24-0B-EB |
| 廠商： | Exar Corporation |
| 文件頁數： | 34/50頁 |
| 文件大?。?/td> | 0K |
| 描述： | EVAL BOARD FOR XR16M670-B 24QFN |
| 標準包裝： | 1 |
| 系列： | * |
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XR16M670
4
1.62V TO 3.63V HIGH PERFORMANCE UART WITH 32-BYTE FIFO
REV. 1.0.1
Pin type: I=Input, O=Output, I/O= Input/output.
DSR#
-
25
C4
I
UART Data-Set-Ready (active low) or general purpose input. This
input should be connected to VCC when not used.
CD#
-
26
-
I
UART Carrier-Detect (active low) or general purpose input. This
input should be connected to VCC when not used.
RI#
-
27
-
I
UART Ring-Indicator (active low) or general purpose input. This
input should be connected to VCC when not used.
ANCILLARY SIGNALS
XTAL1
8
10
D5
I
Crystal or external clock input.
XTAL2
-
11
-
O
Crystal or buffered clock output.
PwrSave
7
-
I
Power-Save (active high). This feature isolates the M670’s data bus
interface from the host preventing other bus activities that cause
higher power drain during sleep mode. See Sleep Mode with Auto
Wake-up and Power-Save Feature section for details. This pin does
not have a pull-down resistor. This input should be connected to
GND when not used.
RESET
17
23
A2
I
This input is active high. A 40 ns minimum active pulse on this pin
will reset the internal registers and all outputs of the UART. The
UART transmitter output will be held at logic 1, the receiver input
will be ignored and outputs are reset during reset period (see UART
Reset Conditions).
VCC
19
28
B1
Pwr
1.62V to 3.63V power supply.
GND
10
13
E5
Pwr
Power supply common, ground.
GND
Center
Pad
Center
Pad
-
Pwr
The center pad on the backside of the QFN package is metallic and
should be connected to GND on the PCB. The thermal pad size on
the PCB should be the approximate size of this center pad and
should be solder mask defined. The solder mask opening should be
at least 0.0025" inwards from the edge of the PCB thermal pad.
NC
-
2, 9, 15,
16
-
No Connects.
Pin Description
NAME
24-QFN
PIN#
32-QFN
PIN#
25-BGA
PIN#
TYPE
DESCRIPTION
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| XR16M580IL32-0B-EB | EVAL BOARD FOR XR16M580-B 32QFN |
相關代理商/技術參數 |
參數描述 |
|---|---|
| XR16M670IL24-0C-EB | 功能描述:界面開發(fā)工具 Eval Board for XR16M670IL24 Series RoHS:否 制造商:Bourns 產品:Evaluation Boards 類型:RS-485 工具用于評估:ADM3485E 接口類型:RS-485 工作電源電壓:3.3 V |
| XR16M670IL24-F | 功能描述:UART 接口集成電路 1.8 HIGH PERFORMANCE UART W/32 RoHS:否 制造商:Texas Instruments 通道數量:2 數據速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| XR16M670IL32 | 制造商:EXAR 制造商全稱:EXAR 功能描述:1.62V TO 3.63V HIGH PERFORMANCE UART WITH 32-BYTE FIFO |
| XR16M670IL32-0A-EB | 功能描述:界面開發(fā)工具 Eval Board for XR16M670IL32 Series RoHS:否 制造商:Bourns 產品:Evaluation Boards 類型:RS-485 工具用于評估:ADM3485E 接口類型:RS-485 工作電源電壓:3.3 V |
| XR16M670IL32-0B-EB | 功能描述:界面開發(fā)工具 Eval Board for XR16M670IL32 Series RoHS:否 制造商:Bourns 產品:Evaluation Boards 類型:RS-485 工具用于評估:ADM3485E 接口類型:RS-485 工作電源電壓:3.3 V |
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