參數(shù)資料
型號: XPC860TZP80D3
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: Family Hardware Specifications
中文描述: 32-BIT, 80 MHz, RISC PROCESSOR, PBGA357
封裝: PLASTIC, BGA-357
文件頁數(shù): 43/76頁
文件大?。?/td> 857K
代理商: XPC860TZP80D3
MOTOROLA
MPC860 Family Hardware Specifications
43
CPM Electrical Characteristics
Figure 10-37. Boundary Scan (JTAG) Timing Diagram
Part XI CPM Electrical Characteristics
This section provides the AC and DC electrical specifications for the communications
processor module (CPM) of the MPC860.
11.1 PIP/PIO AC Electrical Specifications
Table 11-13 provides the PIP/PIO AC timings as shown in Figure 11-38 through
Figure 11-42.
Table 11-13. PIP/PIO Timing
Num
Characteristic
All Frequencies
Unit
Min
Max
21
Data-in setup time to STBI low
0
ns
22
Data-In hold time to STBI high
2.5 – t3
1
1
t3 = Specification 23.
CLK
23
STBI pulse width
1.5
CLK
24
STBO pulse width
1 CLK – 5 ns
ns
25
Data-out setup time to STBO low
2
CLK
26
Data-out hold time from STBO high
5
CLK
27
STBI low to STBO low (Rx interlock)
2
CLK
28
STBI low to STBO high (Tx interlock)
2
CLK
29
Data-in setup time to clock high
15
ns
30
Data-in hold time from clock high
7.5
ns
31
Clock low to data-out valid (CPU writes data, control, or direction)
25
ns
TCK
Output
Signals
Output
Signals
Output
Signals
J92
J94
J93
J95
J96
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