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參數(shù)資料
| 型號(hào)： | XPC823CVR66B2T |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 23/70頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU POWERQUICC 66MHZ 256-PBGA |
| 標(biāo)準(zhǔn)包裝： | 60 |
| 系列： | MPC8xx |
| 處理器類型： | 32-位 MPC8xx PowerQUICC |
| 速度： | 66MHz |
| 電壓： | 1.8V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 256-BGA |
| 供應(yīng)商設(shè)備封裝： | 256-PBGA（23x23） |
| 包裝： | 托盤 |
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MPC823 ELECTRICAL SPECIFICATIONS
3
POWER CONSIDERATIONS
The average chip-junction temperature, T
J
,
in
°C can be obtained from
T
J = TA + (PD qJA)
(1)
where
T
A
=
Ambient Temperature,
C
q
JA
=
Package Thermal Resistance, Junction to Ambient,
C/W
P
D
=P
INT + PI/O
P
INT =IDD x VDD
,
WattsChip Internal Power
P
I/O
=
Power Dissipation on Input and Output PinsUser Determined
For most applications P
I/O < 0.3 PINT and can be neglected. If PI/O is neglected
,
an approximate
relationship between P
D and TJ is:
P
D
=K
(T
J + 273C)
(2)
Solving equations (1) and (2) for K gives
K =
P
D (TA + 273C) + qJA PD
2
(3)
where K is a constant pertaining to the particular part. K can be determined from equation (3)
by measuring P
D
(at equilibrium) for a known T
A
. Using this value of K, the values of P
D and TJ
can be obtained by solving equations (1) and (2) iteratively for any value of T
A.
Layout Practices
Each VCC pin on the MPC823 should be provided with a low-impedance path to the boards
supply. Each GND pin should be provided with a low-impedance path to ground. The power
supply pins drive distinct groups of logic on chip. The VCC power supply should be bypassed to
ground using at least four 0.1
mF bypass capacitors located as close as possible to the four
sides of the package. The capacitor leads and associated printed circuit traces connecting to
chip VCC and GND should be kept to less than half an inch per capacitor lead. A four-layer
board that employs two inner layers as VCC and GND planes should be used.
All output pins on the MPC823 have fast rise and fall times. Printed circuit (PC) trace
interconnection length should be minimized in order to minimize undershoot and reflections
caused by these fast output switching times. This recommendation particularly applies to the
address and data busses. Maximum PC trace lengths of six inches are recommended.
Capacitance calculations should consider all device loads as well as parasitic capacitances
due to the PC traces. Attention to proper PCB layout and bypassing becomes especially critical
in systems with higher capacitive loads because these loads create higher transient currents
in the VCC and GND circuits. Pull up all unused inputs or signals that will be inputs during reset.
Special care should be taken to minimize the noise levels on the PLL supply pins.
F
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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| XPC823CZC66A | 制造商:Freescale Semiconductor 功能描述: |
| XPC823CZT66B2 | 制造商:Freescale Semiconductor 功能描述: |
| XPC823CZT66B2T | 功能描述:IC MPU POWERQUICC 66MHZ 256-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤 |
| XPC823ECVR66B2 | 功能描述:微處理器 - MPU 823E PB-FREE RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| XPC823ECVR66B2 | 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU 66MHZ BGA-256 |
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