MPLAB
-ICE
DS51194D-page 2
2000 Microchip Technology Inc.
Transition sockets are typically composed of two parts: the DIP
adapter socket and the SOIC/SSOP header. The DIP adapter
socket is designed to plug into the emulator system’s DIP device
adapter on one side and the header on the other. The header is
then soldered down to the target application.
The QFP Adapter is a single part soldered directly to the target
application and fits into the QFP device adapter.
WHY SHOULD I USE TRANSITION
SOCKETS IN MY PRODUCT DESIGN
There are two very significant advantages to using transition
sockets:
1.
A shorter product development cycle, and
2.
Reduced expense in the design, layout, and prototype
testing.
A typical product design cycle has two important phases: the pro-
totype design phase and the production design phase. Tradition-
ally, these phases were different simply because the prototype
used a microcontroller with a different package type. However,
with the availability of the transition sockets, the prototype design
can be identical to the production design because a transition
socket can be used to bridge the microcontroller package differ-
ences.
WHAT ARE THE CURRENTLY
AVAILABLE TRANSITION SOCKETS
Microchip Technology currently offers the following transition
sockets for use with our emulator systems:
PDIP – 28-Lead, 0.300-inch Male to 0.600-inch Female
SOIC – 8-, 14-, 18-, 20- and 28-Lead
SSOP – 20- and 28-Lead
QFP – 44-, 64- and 80-Lead
Please check the Microchip web site (www.microchip.com) for
the most current version of this document.