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參數(shù)資料
| 型號(hào)： | XE5620SM |
| 英文描述： | DIP. 2.175 in. by 1.00 in. by 0.30 in. |
| 中文描述： | 下跌。 2.175英寸由0.30英寸由一點(diǎn)零零英寸 |
| 文件頁(yè)數(shù)： | 5/19頁(yè) |
| 文件大小： | 124K |
| 代理商： | XE5620SM |
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XECOM
(5)
XE5620G
XE5620G Soldering Instructions
The XE5620G is subject to damage if over-exposed to heat during solder reflow operations. Following the
soldering instructions below will ensure that the process of soldering the module to the board does not damage
the modem. The XE5620G must not be exposed to direct Infrared (IR) heating. If your process includes direct
IR heating, you must shield the XE5620G from the infrared rays.
Maximum Temperature
Maximum Time at 220
O
C
220
O
C
20 Seconds
90 Seconds
180 Seconds
Maximum Time above Eutectic (180
O
C)
Maximum Preheat Dwell Time
Maximum Recommended Solder Temperature Profile
220
O
C
180
O
C
150
O
C
-20 sec-
--------------------------------180 sec max ---------------------
max
----- 90 sec max -----
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