參數(shù)資料
型號(hào): XD1005-BD-000V
廠商: MIMIX BROADBAND INC
元件分類: 衰減器
英文描述: 10.0-40.0 GHz GaAs MMIC Distributed Amplifier
中文描述: 10000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封裝: ROHS COMPLIANT, PLASTIC, DIE-3
文件頁數(shù): 4/6頁
文件大?。?/td> 324K
代理商: XD1005-BD-000V
1
2
3
1.250
(0.049)
0.406
(0.016)
1.500
(0.059)
0.0
0.0
1.070
(0.042)
0.820
(0.032)
RF In
RF Out
1
2
3
Vd
Page 4 of 6
Mechanical Drawing
Bias Arrangement
Bypass Capacitors
- See App
N
ote [2]
(Note: Engineering designator is 22DSBA0423)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.004
3
+/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.16
3
mg
Bond Pad #1 (RF In)
Bond Pad #2 (RF Out)
Bond Pad #
3
(
V
d)
10.0-40.0 GHz GaAs MMIC
Distributed Amplifier
D1005-BD
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
January 2007 - Rev 16-Jan-07
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