- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄4204 > XCV1600E-7BG560C (Xilinx Inc)IC FPGA 1.8V C-TEMP 560-MBGA PDF資料下載
參數(shù)資料
| 型號： | XCV1600E-7BG560C |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 79/233頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA 1.8V C-TEMP 560-MBGA |
| 產(chǎn)品變化通告： | FPGA Family Discontinuation 18/Apr/2011 |
| 標準包裝： | 1 |
| 系列： | Virtex®-E |
| LAB/CLB數(shù)： | 7776 |
| 邏輯元件/單元數(shù)： | 34992 |
| RAM 位總計： | 589824 |
| 輸入/輸出數(shù)： | 404 |
| 門數(shù)： | 2188742 |
| 電源電壓： | 1.71 V ~ 1.89 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 85°C |
| 封裝/外殼： | 560-LBGA，金屬 |
| 供應商設備封裝： | 560-MBGA（42.5x42.5） |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁當前第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁第137頁第138頁第139頁第140頁第141頁第142頁第143頁第144頁第145頁第146頁第147頁第148頁第149頁第150頁第151頁第152頁第153頁第154頁第155頁第156頁第157頁第158頁第159頁第160頁第161頁第162頁第163頁第164頁第165頁第166頁第167頁第168頁第169頁第170頁第171頁第172頁第173頁第174頁第175頁第176頁第177頁第178頁第179頁第180頁第181頁第182頁第183頁第184頁第185頁第186頁第187頁第188頁第189頁第190頁第191頁第192頁第193頁第194頁第195頁第196頁第197頁第198頁第199頁第200頁第201頁第202頁第203頁第204頁第205頁第206頁第207頁第208頁第209頁第210頁第211頁第212頁第213頁第214頁第215頁第216頁第217頁第218頁第219頁第220頁第221頁第222頁第223頁第224頁第225頁第226頁第227頁第228頁第229頁第230頁第231頁第232頁第233頁
Virtex-E 1.8 V Field Programmable Gate Arrays
R
DS022-2 (v3.0) March 21, 2014
Module 2 of 4
Production Product Specification
11
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Development System
Virtex-E FPGAs are supported by the Xilinx Foundation and
Alliance Series CAE tools. The basic methodology for
Virtex-E design consists of three interrelated steps: design
entry, implementation, and verification. Industry-standard
tools are used for design entry and simulation (for example,
Synopsys FPGA Express), while Xilinx provides proprietary
architecture-specific tools for implementation.
The Xilinx development system is integrated under the
Xilinx Design Manager (XDM) software, providing design-
ers with a common user interface regardless of their choice
of entry and verification tools. The XDM software simplifies
the selection of implementation options with pull-down
menus and on-line help.
Application programs ranging from schematic capture to
Placement and Routing (PAR) can be accessed through the
XDM software. The program command sequence is gener-
ated prior to execution, and stored for documentation.
Several advanced software features facilitate Virtex-E design.
RPMs, for example, are schematic-based macros with relative
location constraints to guide their placement. They help
ensure optimal implementation of common functions.
For HDL design entry, the Xilinx FPGA Foundation develop-
ment system provides interfaces to the following synthesis
design environments.
Synopsys (FPGA Compiler, FPGA Express)
Exemplar (Spectrum)
Synplicity (Synplify)
For schematic design entry, the Xilinx FPGA Foundation
and Alliance development system provides interfaces to the
following schematic-capture design environments.
Mentor Graphics V8 (Design Architect, QuickSim II)
Viewlogic Systems (Viewdraw)
Third-party vendors support many other environments.
A standard interface-file specification, Electronic Design
Interchange Format (EDIF), simplifies file transfers into and
out of the development system.
Virtex-E FPGAs are supported by a unified library of stan-
dard functions. This library contains over 400 primitives and
macros, ranging from 2-input AND gates to 16-bit accumu-
lators, and includes arithmetic functions, comparators,
counters, data registers, decoders, encoders, I/O functions,
latches, Boolean functions, multiplexers, shift registers, and
barrel shifters.
The “soft macro” portion of the library contains detailed
descriptions of common logic functions, but does not con-
tain any partitioning or placement information. The perfor-
mance of these macros depends, therefore, on the
partitioning and placement obtained during implementation.
RPMs, on the other hand, do contain predetermined parti-
tioning and placement information that permits optimal
implementation of these functions. Users can create their
own library of soft macros or RPMs based on the macros
and primitives in the standard library.
The design environment supports hierarchical design entry,
with high-level schematics that comprise major functional
blocks, while lower-level schematics define the logic in
these blocks. These hierarchical design elements are auto-
matically combined by the implementation tools. Different
design entry tools can be combined within a hierarchical
design, thus allowing the most convenient entry method to
be used for each portion of the design.
Design Implementation
The place-and-route tools (PAR) automatically provide the
implementation flow described in this section. The parti-
tioner takes the EDIF net list for the design and maps the
logic into the architectural resources of the FPGA (CLBs
and IOBs, for example). The placer then determines the
best locations for these blocks based on their interconnec-
tions and the desired performance. Finally, the router inter-
connects the blocks.
The PAR algorithms support fully automatic implementation
of most designs. For demanding applications, however, the
user can exercise various degrees of control over the pro-
cess. User partitioning, placement, and routing information
is optionally specified during the design-entry process. The
implementation of highly structured designs can benefit
greatly from basic floor planning.
The implementation software incorporates Timing Wizard
timing-driven placement and routing. Designers specify tim-
ing requirements along entire paths during design entry.
The timing path analysis routines in PAR then recognize
these user-specified requirements and accommodate them.
Timing requirements are entered on a schematic in a form
directly relating to the system requirements, such as the tar-
geted clock frequency, or the maximum allowable delay
between two registers. In this way, the overall performance
of the system along entire signal paths is automatically tai-
lored to user-generated specifications. Specific timing infor-
mation for individual nets is unnecessary.
Design Verification
In addition to conventional software simulation, FPGA users
can use in-circuit debugging techniques. Because Xilinx
devices are infinitely reprogrammable, designs can be veri-
fied in real time without the need for extensive sets of soft-
ware simulation vectors.
The development system supports both software simulation
and in-circuit debugging techniques. For simulation, the
system extracts the post-layout timing information from the
design database, and back-annotates this information into
the net list for use by the simulator. Alternatively, the user
can verify timing-critical portions of the design using the
TRCE static timing analyzer.
相關PDF資料 |
PDF描述 |
|---|---|
| IDT71V016SA20YG8 | IC SRAM 1MBIT 20NS 44SOJ |
| XCV1600E-6BG560I | IC FPGA 1.8V I-TEMP 560-MBGA |
| IDT71V016SA10YG8 | IC SRAM 1MBIT 10NS 44SOJ |
| XC4VLX100-10FF1513I | IC FPGA VIRTEX-4LX 1513FFBGA |
| XC2V4000-4BF957I | IC FPGA VIRTEX-II 957FCBGA |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| XCV1600E-7BG560I | 功能描述:IC FPGA 1.8V I-TEMP 560-MBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Virtex®-E 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標準包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計:3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應商設備封裝:120-CPGA（34.55x34.55） |
| XCV1600E-7FG1156C | 功能描述:IC FPGA 1.8V C-TEMP 1156-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Virtex®-E 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標準包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計:3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應商設備封裝:120-CPGA（34.55x34.55） |
| XCV1600E-7FG1156I | 功能描述:IC FPGA 1.8V I-TEMP 1156-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Virtex®-E 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標準包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計:3200 輸入/輸出數(shù):80 門數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應商設備封裝:120-CPGA（34.55x34.55） |
| XCV1600E-7FG240C | 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex⑩-E 1.8 V Field Programmable Gate Arrays |
| XCV1600E-7FG240I | 制造商:XILINX 制造商全稱:XILINX 功能描述:Virtex-E 1.8 V Field Programmable Gate Arrays |
發(fā)布緊急采購，3分鐘左右您將得到回復。