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    • 您現(xiàn)在的位置:買(mǎi)賣(mài)IC網(wǎng) > PDF目錄4032 > XC4025E-4PG299C (Xilinx Inc)IC FPGA C-TEMP 5V 4 SPD 299-CPGA PDF資料下載
    參數(shù)資料
    型號(hào): XC4025E-4PG299C
    廠商: Xilinx Inc
    文件頁(yè)數(shù): 13/68頁(yè)
    文件大?。?/td> 0K
    描述: IC FPGA C-TEMP 5V 4 SPD 299-CPGA
    產(chǎn)品變化通告: XC4000(E,L) Discontinuation 01/April/2002
    標(biāo)準(zhǔn)包裝: 10
    系列: XC4000E/X
    LAB/CLB數(shù): 1024
    邏輯元件/單元數(shù): 2432
    RAM 位總計(jì): 32768
    輸入/輸出數(shù): 256
    門(mén)數(shù): 25000
    電源電壓: 4.75 V ~ 5.25 V
    安裝類型: 表面貼裝
    工作溫度: 0°C ~ 85°C
    封裝/外殼: 299-BCBGA
    供應(yīng)商設(shè)備封裝: 299-CPGA(52.3x52.3)
    第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)當(dāng)前第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)
    R
    XC4000E and XC4000X Series Field Programmable Gate Arrays
    6-24
    May 14, 1999 (Version 1.6)
    Any XC4000 Series 5-Volt device with its outputs cong-
    ured in TTL mode can drive the inputs of any typical
    3.3-Volt device. (For a detailed discussion of how to inter-
    face between 5 V and 3.3 V devices, see the 3V Products
    section of
    The Programmable Logic Data Book.)
    Supported destinations for XC4000 Series device outputs
    are shown in Table 12.
    An output can be congured as open-drain (open-collector)
    by placing an OBUFT symbol in a schematic or HDL code,
    then tying the 3-state pin (T) to the output signal, and the
    input pin (I) to Ground. (See Figure 18.)
    Table 12: Supported Destinations for XC4000 Series
    Outputs
    Output Slew Rate
    The slew rate of each output buffer is, by default, reduced,
    to minimize power bus transients when switching non-criti-
    cal signals. For critical signals, attach a FAST attribute or
    property to the output buffer or ip-op.
    For XC4000E devices, maximum total capacitive load for
    simultaneous fast mode switching in the same direction is
    200 pF for all package pins between each Power/Ground
    pin
    pair.
    For
    XC4000X
    devices,
    additional
    internal
    Power/Ground pin pairs are connected to special Power
    and Ground planes within the packages, to reduce ground
    bounce. Therefore, the maximum total capacitive load is
    300 pF between each external Power/Ground pin pair.
    Maximum loading may vary for the low-voltage devices.
    For slew-rate limited outputs this total is two times larger for
    each device type: 400 pF for XC4000E devices and 600 pF
    for XC4000X devices. This maximum capacitive load
    should not be exceeded, as it can result in ground bounce
    of greater than 1.5 V amplitude and more than 5 ns dura-
    tion. This level of ground bounce may cause undesired
    transient behavior on an output, or in the internal logic. This
    restriction is common to all high-speed digital ICs, and is
    not particular to Xilinx or the XC4000 Series.
    XC4000 Series devices have a feature called “Soft
    Start-up,” designed to reduce ground bounce when all out-
    puts are turned on simultaneously at the end of congura-
    tion.
    When the conguration process is nished and the
    device starts up, the rst activation of the outputs is auto-
    matically slew-rate limited. Immediately following the initial
    activation of the I/O, the slew rate of the individual outputs
    is determined by the individual conguration option for each
    IOB.
    Global Three-State
    A separate Global 3-State line (not shown in Figure 15 or
    Figure 16) forces all FPGA outputs to the high-impedance
    state, unless boundary scan is enabled and is executing an
    EXTEST instruction. This global net (GTS) does not com-
    pete with other routing resources; it uses a dedicated distri-
    bution network.
    GTS can be driven from any user-programmable pin as a
    global 3-state input. To use this global net, place an input
    pad and input buffer in the schematic or HDL code, driving
    the GTS pin of the STARTUP symbol. A specic pin loca-
    tion can be assigned to this input using a LOC attribute or
    property, just as with any other user-programmable pad. An
    inverter can optionally be inserted after the input buffer to
    invert the sense of the Global 3-State signal. Using GTS is
    similar to GSR. See Figure 2 on page 11 for details.
    Alternatively, GTS can be driven from any internal node.
    Destination
    XC4000 Series
    Outputs
    3.3 V,
    CMOS
    5 V,
    TTL
    5 V,
    CMOS
    Any typical device, Vcc = 3.3 V,
    CMOS-threshold inputs
    √√
    some1
    1. Only if destination device has 5-V tolerant inputs
    Any device, Vcc = 5 V,
    TTL-threshold inputs
    √√√
    Any device, Vcc = 5 V,
    CMOS-threshold inputs
    Unreliable
    Data
    √
    X6702
    OPAD
    OBUFT
    Figure 18: Open-Drain Output
    Product Obsolete or Under Obsolescence
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    XC4025E-4PG299I 功能描述:IC FPGA I-TEMP 5V 4 SPD 299-CPGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:XC4000E/X 標(biāo)準(zhǔn)包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計(jì):16404480 輸入/輸出數(shù):350 門(mén)數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:900-FCBGA(31x31) 其它名稱:122-1789
    XC4028EX-2HQ208C 功能描述:IC FPGA 1024 CLB'S 208-HQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:XC4000E/X 產(chǎn)品變化通告:XC4000(E,L) Discontinuation 01/April/2002 標(biāo)準(zhǔn)包裝:24 系列:XC4000E/X LAB/CLB數(shù):100 邏輯元件/單元數(shù):238 RAM 位總計(jì):3200 輸入/輸出數(shù):80 門(mén)數(shù):3000 電源電壓:4.5 V ~ 5.5 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:120-BCBGA 供應(yīng)商設(shè)備封裝:120-CPGA(34.55x34.55)
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