參數(shù)資料
型號(hào)： XC4010XL-2TQ176C
廠商： Xilinx Inc
文件頁(yè)數(shù)： 13/68頁(yè)
文件大小： 0K
描述： IC FPGA C-TEMP 3.3V 2SPD 176TQFP
產(chǎn)品變化通告： Product Discontinuation Notice 28/July/2008
標(biāo)準(zhǔn)包裝： 40
系列： XC4000E/X
LAB/CLB數(shù)： 400
邏輯元件/單元數(shù)： 950
RAM 位總計(jì)： 12800
輸入/輸出數(shù)： 145
門數(shù)： 10000
電源電壓： 3 V ~ 3.6 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 176-LQFP
供應(yīng)商設(shè)備封裝： 176-TQFP（24x24）
R
XC4000E and XC4000X Series Field Programmable Gate Arrays
6-24
May 14, 1999 (Version 1.6)
Any XC4000 Series 5-Volt device with its outputs cong-
ured in TTL mode can drive the inputs of any typical
3.3-Volt device. (For a detailed discussion of how to inter-
face between 5 V and 3.3 V devices, see the 3V Products
section of
The Programmable Logic Data Book.)
Supported destinations for XC4000 Series device outputs
are shown in Table 12.
An output can be congured as open-drain (open-collector)
by placing an OBUFT symbol in a schematic or HDL code,
then tying the 3-state pin (T) to the output signal, and the
input pin (I) to Ground. (See Figure 18.)
Table 12: Supported Destinations for XC4000 Series
Outputs
Output Slew Rate
The slew rate of each output buffer is, by default, reduced,
to minimize power bus transients when switching non-criti-
cal signals. For critical signals, attach a FAST attribute or
property to the output buffer or ip-op.
For XC4000E devices, maximum total capacitive load for
simultaneous fast mode switching in the same direction is
200 pF for all package pins between each Power/Ground
pin
pair.
For
XC4000X
devices,
additional
internal
Power/Ground pin pairs are connected to special Power
and Ground planes within the packages, to reduce ground
bounce. Therefore, the maximum total capacitive load is
300 pF between each external Power/Ground pin pair.
Maximum loading may vary for the low-voltage devices.
For slew-rate limited outputs this total is two times larger for
each device type: 400 pF for XC4000E devices and 600 pF
for XC4000X devices. This maximum capacitive load
should not be exceeded, as it can result in ground bounce
of greater than 1.5 V amplitude and more than 5 ns dura-
tion. This level of ground bounce may cause undesired
transient behavior on an output, or in the internal logic. This
restriction is common to all high-speed digital ICs, and is
not particular to Xilinx or the XC4000 Series.
XC4000 Series devices have a feature called “Soft
Start-up,” designed to reduce ground bounce when all out-
puts are turned on simultaneously at the end of congura-
tion.
When the conguration process is nished and the
device starts up, the rst activation of the outputs is auto-
matically slew-rate limited. Immediately following the initial
activation of the I/O, the slew rate of the individual outputs
is determined by the individual conguration option for each
IOB.
Global Three-State
A separate Global 3-State line (not shown in Figure 15 or
Figure 16) forces all FPGA outputs to the high-impedance
state, unless boundary scan is enabled and is executing an
EXTEST instruction. This global net (GTS) does not com-
pete with other routing resources; it uses a dedicated distri-
bution network.
GTS can be driven from any user-programmable pin as a
global 3-state input. To use this global net, place an input
pad and input buffer in the schematic or HDL code, driving
the GTS pin of the STARTUP symbol. A specic pin loca-
tion can be assigned to this input using a LOC attribute or
property, just as with any other user-programmable pad. An
inverter can optionally be inserted after the input buffer to
invert the sense of the Global 3-State signal. Using GTS is
similar to GSR. See Figure 2 on page 11 for details.
Alternatively, GTS can be driven from any internal node.
Destination
XC4000 Series
Outputs
3.3 V,
CMOS
5 V,
TTL
5 V,
CMOS
Any typical device, Vcc = 3.3 V,
CMOS-threshold inputs
√√
some1
1. Only if destination device has 5-V tolerant inputs
Any device, Vcc = 5 V,
TTL-threshold inputs
√√√
Any device, Vcc = 5 V,
CMOS-threshold inputs
Unreliable
Data
√
X6702
OPAD
OBUFT
Figure 18: Open-Drain Output
Product Obsolete or Under Obsolescence
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XC4010XL-2TQ176I 功能描述:IC FPGA I-TEMP 3.3V 2SPD 176TQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:XC4000E/X 標(biāo)準(zhǔn)包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計(jì):16404480 輸入/輸出數(shù):350 門數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:900-FCBGA（31x31） 其它名稱:122-1789
XC4010XL-2TQ176M 制造商:XILINX 制造商全稱:XILINX 功能描述:XC4000E and XC4000X Series Field Programmable Gate Arrays
XC4010XL-3BG256C 功能描述:IC FPGA C-TEMP 3.3V 3SPD 256PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:XC4000E/X 標(biāo)準(zhǔn)包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計(jì):16404480 輸入/輸出數(shù):350 門數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:900-FCBGA（31x31） 其它名稱:122-1789
XC4010XL-3BG256I 功能描述:IC FPGA I-TEMP 3.3V 3SPD 256PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:XC4000E/X 標(biāo)準(zhǔn)包裝:1 系列:Kintex-7 LAB/CLB數(shù):25475 邏輯元件/單元數(shù):326080 RAM 位總計(jì):16404480 輸入/輸出數(shù):350 門數(shù):- 電源電壓:0.97 V ~ 1.03 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:900-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:900-FCBGA（31x31） 其它名稱:122-1789
XC4010XL-3BG256M 制造商:XILINX 制造商全稱:XILINX 功能描述:XC4000E and XC4000X Series Field Programmable Gate Arrays
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