
2-162
XC3000A Logic Cell Array Family
Symbol Description
Units
V
CC
Supply voltage relative to GND
–0.5 to +7.0
V
V
IN
Input voltage with respect to GND
–0.5 to V
CC
+0.5
V
V
TS
Voltage applied to 3-state output
–0.5 to V
CC
+0.5
V
T
STG
Storage temperature (ambient)
–65 to +150
°
C
T
SOL
Maximum soldering temperature (10 s @ 1/16 in.)
+260
°
C
Junction temperature plastic
+125
°
C
T
J
Junction temperature ceramic
+150
°
C
Note:
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those listed under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum
Ratings conditions for extended periods of time may affect device reliability.
Symbol
Description
Min
Max
Units
V
CC
Supply voltage relative to GND Commercial 0
°
C to +85
°
C junction
4.75
5.25
V
Supply voltage relative to GND Industrial -40
°
C to +100
°
C junction
4.5
5.5
V
V
IHT
High-level input voltage — TTL configuration
2.0
V
CC
V
V
ILT
Low-level input voltage — TTL configuration
0
0.8
V
V
IHC
High-level input voltage — CMOS configuration
70%
100%
V
CC
V
ILC
Low-level input voltage — CMOS configuration
0
20%
V
CC
T
IN
Input signal transition time
250
ns
Absolute Maximum Ratings
Operating Conditions
Xilinx maintains test specifications for each product as controlled documents. To insure the use of the most recently
released device performance parameters, please request a copy of the current test-specification revision.
At junction temperatures above those listed as Operating Conditions, all delay parameters increase by 0.3% per
°
C.