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參數(shù)資料
| 型號： | XC2S200-5FG456C |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 47/99頁 |
| 文件大小： | 0K |
| 描述： | IC FPGA 2.5V 1176 CLB'S 456-FBGA |
| 標(biāo)準(zhǔn)包裝： | 60 |
| 系列： | Spartan®-II |
| LAB/CLB數(shù)： | 1176 |
| 邏輯元件/單元數(shù)： | 5292 |
| RAM 位總計： | 57344 |
| 輸入/輸出數(shù)： | 284 |
| 門數(shù)： | 200000 |
| 電源電壓： | 2.375 V ~ 2.625 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 85°C |
| 封裝/外殼： | 456-BBGA |
| 供應(yīng)商設(shè)備封裝： | 456-FBGA |
| 其它名稱： | 122-1233 XC2S200-5FG456C-ND |
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DS001-3 (v2.8) June 13, 2008
Module 3 of 4
Product Specification
51
2000-2008 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. All other
trademarks are the property of their respective owners.
Definition of Terms
In this document, some specifications may be designated as Advance or Preliminary. These terms are defined as follows:
Advance: Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or families. Values
are subject to change. Use as estimates, not for production.
Preliminary: Based on preliminary characterization. Further changes are not expected.
Unmarked: Specifications not identified as either Advance or Preliminary are to be considered Final.
Except for pin-to-pin input and output parameters, the AC parameter delay specifications included in this document are
derived from measuring internal test patterns. All limits are representative of worst-case supply voltage and junction
temperature conditions. Typical numbers are based on measurements taken at a nominal VCCINT level of 2.5V and a junction
temperature of 25°C. The parameters included are common to popular designs and typical applications. All specifications
are subject to change without notice.
DC Specifications
Absolute Maximum Ratings(1)
68
Spartan-II FPGA Family:
DC and Switching Characteristics
DS001-3 (v2.8) June 13, 2008
Product Specification
R
Symbol
Description
Min
Max
Units
VCCINT
Supply voltage relative to GND(2)
–0.5
3.0
V
VCCO
Supply voltage relative to GND(2)
–0.5
4.0
V
VREF
Input reference voltage
–0.5
3.6
V
VIN
Input voltage relative to GND(3)
5V tolerant I/O(4)
–0.5
5.5
V
No 5V tolerance(5)
–0.5
VCCO +0.5
V
VTS
Voltage applied to 3-state output
5V tolerant I/O (4)
–0.5
5.5
V
No 5V tolerance(5)
–0.5
VCCO +0.5
V
TSTG
Storage temperature (ambient)
–65
+150
°C
TJ
Junction temperature
-
+125
°C
Notes:
1.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
2.
Power supplies may turn on in any order.
3.
VIN should not exceed VCCO by more than 3.6V over extended periods of time (e.g., longer than a day).
4.
Spartan-II device I/Os are 5V Tolerant whenever the LVTTL, LVCMOS2, or PCI33_5 signal standard has been selected. With 5V
Tolerant I/Os selected, the Maximum DC overshoot must be limited to either +5.5V or 10 mA, and undershoot must be limited to
either –0.5V or 10 mA, whichever is easier to achieve. The Maximum AC conditions are as follows: The device pins may undershoot
to –2.0V or overshoot to +7.0V, provided this over/undershoot lasts no more than 11 ns with a forcing current no greater than 100 mA.
5.
Without 5V Tolerant I/Os selected, the Maximum DC overshoot must be limited to either VCCO + 0.5V or 10 mA, and undershoot must
be limited to –0.5V or 10 mA, whichever is easier to achieve. The Maximum AC conditions are as follows: The device pins may
undershoot to –2.0V or overshoot to VCCO + 2.0V, provided this over/undershoot lasts no more than 11 ns with a forcing current no
greater than 100 mA.
6.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XC2S2005FG456C-ES | 制造商:Xilinx 功能描述: |
| XC2S200-5FG456I | 功能描述:IC FPGA 2.5V I-TEMP 456-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XC2S200-5FGG256C | 功能描述:IC SPARTAN-II FPGA 200K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XC2S200-5FGG256I | 功能描述:IC SPARTAN-II FPGA 200K 256-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
| XC2S200-5FGG456C | 功能描述:IC SPARTAN-II FPGA 200K 456-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27） |
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