參數(shù)資料
型號(hào)： XC17S10XLVO8C
廠商： Xilinx Inc
文件頁數(shù)： 3/11頁
文件大?。?/td> 0K
描述： IC 3V PROM SER 10K 8-SOIC
產(chǎn)品變化通告： Product Discontinuation 28/Jul/2010
標(biāo)準(zhǔn)包裝： 98
可編程類型： OTP
存儲(chǔ)容量： 100kb
電源電壓： 3 V ~ 3.6 V
工作溫度： 0°C ~ 70°C
封裝/外殼： 8-SOIC（0.154"，3.90mm 寬）
供應(yīng)商設(shè)備封裝： 8-TSOP
包裝： 管件
Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL)
DS030 (v1.12) June 20, 2008
Product Specification
11
R
Notice of Disclaimer
THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND
CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED
WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE
SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE
PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES
THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
07/09/07
1.11
Updated document format.
Left diagram under "Pinout Diagrams," page 2 updated to reflect new Lead-free packaging.
Deleted parameter T
SOL, Maximum Soldering Temperature, under "Absolute Maximum Ratings
page 6. Refer to UG112, Xilinx Device Package User Guide, for package soldering guidelines.
Added note to "DC Characteristics Over Operating Condition," page 6 and corrected XC17S40 I
CCA
value.
Added Lead-free (RoHS-compliant) packages PDG8 and VOG8 to "Ordering Information," page 9.
Added new part numbers to and deleted XC17S200XL from "Spartan 3.3V Valid Ordering Combinations
Added new Lead-free package types G and H to "Marking Information," page 10.
06/20/08
1.12
Updated document template.
Updated copyright statement.
Added junction temperature to "Absolute Maximum Ratings(1)," page 6.
Added support for XC17S30SOG8I.
Added new Lead-free package type O to "Marking Information," page 10.
Product Obsolete or Under Obsolescence
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XC17S10XLVO8I 功能描述:IC 3V PROM SER 10K 8-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC17S10XLVOG8C 功能描述:IC PROM SERIEAL 10K 8-SOIC RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC17S10XLVOG8I 功能描述:IC PROM SERIEAL 10K 8-SOIC RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC17S150APD8C 功能描述:IC PROM SER 150000 C-TEMP 8-DIP RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC17S150APD8C0280 制造商:Xilinx 功能描述:
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