參數(shù)資料
型號(hào): XA3S500E-4FT256Q
廠商: Xilinx Inc
文件頁(yè)數(shù): 33/37頁(yè)
文件大?。?/td> 0K
描述: IC FPGA SPARTAN-3E 256FPBGA
標(biāo)準(zhǔn)包裝: 90
系列: Spartan®-3E XA
LAB/CLB數(shù): 1164
邏輯元件/單元數(shù): 10476
RAM 位總計(jì): 368640
輸入/輸出數(shù): 190
門數(shù): 500000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 125°C
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-FTBGA
DS635 (v2.0) September 9, 2009
Product Specification
5
R
Package Marking
Figure 2 provides a top marking example for XA Spartan-3E
FPGAs in the quad-flat packages. Figure 3 shows the top
marking for XA Spartan-3E FPGAs in BGA packages
except the 132-ball chip-scale package (CPG132). The
markings for the BGA packages are nearly identical to those
for the quad-flat packages, except that the marking is
rotated with respect to the ball A1 indicator. Figure 4 shows
the top marking for XA Spartan-3E FPGAs in the CPG132
package.
Note: No marking is shown for stepping.
Figure 2: XA Spartan-3E FPGA QFP Package Marking Example
Date Code
Mask Revision Code
Process Technology
XA3S250E
TM
PQG208AGQ0525
D1234567A
4I
SPARTAN
Device Type
Package
Speed Grade
Temperature Range
Fabrication Code
Pin P1
R
Lot Code
DS635-1_02_082807
Figure 3: XA Spartan-3E FPGA BGA Package Marking Example
Lot Code
Date Code
XA3S250E
TM
4I
SPARTAN
Device Type
BGA Ball A1
Package
Speed Grade
Temperature Range
R
Mask Revision Code
Process Code
Fabrication Code
FTG256AGQ0525
D1234567A
FTG256AGQ0525
D1234567A
DS635_03_082807
Figure 4: XA Spartan-3E FPGA CPG132 Package Marking Example
Date Code
Temperature Range
Speed Grade
3S250E
C6AGQ
4I
Device Type
Ball A1
Lot Code
Package
C6 = CPG132
Mask Revision Code
Fabrication Code
DS635_04_082807
F1234567-0525
PHILIPPINES
Process Code
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