FMUL" />
參數(shù)資料
型號(hào): XA3S100E-4TQG144Q
廠商: Xilinx Inc
文件頁數(shù): 16/37頁
文件大?。?/td> 0K
描述: IC FPGA SPARTAN-3E 100K 144-TQFP
標(biāo)準(zhǔn)包裝: 60
系列: Spartan®-3E XA
LAB/CLB數(shù): 240
邏輯元件/單元數(shù): 2160
RAM 位總計(jì): 73728
輸入/輸出數(shù): 108
門數(shù): 100000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 125°C
封裝/外殼: 144-LQFP
供應(yīng)商設(shè)備封裝: 144-TQFP(20x20)
DS635 (v2.0) September 9, 2009
Product Specification
23
R
Block RAM Timing
Clock Frequency
FMULT
Internal operating frequency for a two-stage 18x18 multiplier using the
AREG and BREG input registers and the PREG output register(1)
0240
MHz
Notes:
1.
Combinatorial delay is less and pipelined performance is higher when multiplying input data with less than 18 bits.
2.
The PREG register is typically used in both single-stage and two-stage pipelined multiplier implementations.
3.
Input registers AREG or BREG are typically used when inferring a two-stage multiplier.
Table 24: 18 x 18 Embedded Multiplier Timing (Continued)
Symbol
Description
-4 Speed Grade
Units
Min
Max
Table 25: Block RAM Timing
Symbol
Description
-4 Speed Grade
Units
Min
Max
Clock-to-Output Times
TBCKO
When reading from block RAM, the delay from the active transition
at the CLK input to data appearing at the DOUT output
-2.82
ns
Setup Times
TBACK
Setup time for the ADDR inputs before the active transition at the
CLK input of the block RAM
0.38
-ns
TBDCK
Setup time for data at the DIN inputs before the active transition at
the CLK input of the block RAM
0.23
-ns
TBECK
Setup time for the EN input before the active transition at the CLK
input of the block RAM
0.77
-ns
TBWCK
Setup time for the WE input before the active transition at the CLK
input of the block RAM
1.26
-ns
Hold Times
TBCKA
Hold time on the ADDR inputs after the active transition at the CLK
input
0.14
-ns
TBCKD
Hold time on the DIN inputs after the active transition at the CLK
input
0.13
-ns
TBCKE
Hold time on the EN input after the active transition at the CLK input
0
-ns
TBCKW
Hold time on the WE input after the active transition at the CLK input
0
-ns
相關(guān)PDF資料
PDF描述
XA3S100E-4CPG132Q IC FPGA SPARTAN-3E 100K 132CSBGA
XC3S200A-5FTG256C IC SPARTAN-3A FPGA 200K 256FTBGA
EHDB9FF CONN DSUB 9PIN FEMALE-FEMALE
93LC86BT-I/OT IC EEPROM 16KBIT 3MHZ SOT23-6
93LC66A-E/P IC EEPROM 4KBIT 2MHZ 8DIP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XA3S100E-4VQG100I 功能描述:IC FPGA SPARTAN-3E 100K 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S100E-4VQG100Q 功能描述:IC FPGA SPARTAN-3E 100K 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S1200E-4FGG400I 功能描述:IC FPGA SPARTAN-3E 1200K 400-FBG RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S1200E-4FGG400Q 功能描述:IC FPGA SPARTAN-3E 1200K 400-FBG RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S1200E-4FTG256I 功能描述:IC FPGA SPARTAN3E 1200K 256FTBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3E XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)