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參數(shù)資料
| 型號： | XA2S300E-6FT256Q |
| 廠商： | Xilinx Inc |
| 文件頁數(shù)： | 3/6頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA SPARTAN-IIE 256FPBGA |
| 產(chǎn)品變化通告： | FPGA Family Discontinuation 18/Apr/2011 |
| 標(biāo)準(zhǔn)包裝： | 90 |
| 系列： | Spartan®-IIE XA |
| LAB/CLB數(shù)： | 1536 |
| 邏輯元件/單元數(shù)： | 6912 |
| RAM 位總計： | 65536 |
| 輸入/輸出數(shù)： | 182 |
| 門數(shù)： | 300000 |
| 電源電壓： | 1.71 V ~ 1.89 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 125°C |
| 封裝/外殼： | 256-LBGA |
| 供應(yīng)商設(shè)備封裝： | 256-FTBGA |
Spartan-IIE 1.8V FPGA Automotive XA Product Family: Introduction and Ordering
DS106-1 (v2.0) August 9, 2013
3
Product Specification
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
DC Specifications
Absolute Maximum Ratings(1)
Figure 1: Basic Spartan-IIE Family FPGA Block Diagram
DLL
B
L
OC
K
RA
M
B
L
OC
K
RA
M
B
L
OC
K
RA
M
B
L
OC
K
RA
M
I/O LOGIC
DS077_01_052102
Symbol
Description
Min
Max
Units
VCCINT
Supply voltage relative to GND
–0.5
2.0
V
VCCO
Supply voltage relative to GND
–0.5
4.0
V
VREF
Input reference voltage
–0.5
4.0
V
VIN
Input voltage relative to GND(2,3)
–0.5
4.05
V
VTS
Voltage applied to 3-state output (3)
–0.5
4.0
V
TSTG
Storage temperature (ambient)
–65
+150
°C
TJ
Junction temperature
-
+135
°C
Notes:
1.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
2.
VIN should not exceed VCCO by more than 3.6V over extended periods of time (e.g., longer than a day).
3.
Maximum DC overshoot must be limited to either VCCO + 0.5V or 10 mA, and undershoot must be limited to –0.5V or 10 mA,
whichever is easier to achieve. The Maximum AC conditions are as follows: The device pins may undershoot to –2.0V or overshoot
to VCCO + 2.0V, provided this over/undershoot lasts no more than 11 ns with a forcing current no greater than 100 mA.
4.
For soldering guidelines, see the Packaging Information on the Xilinx Web site.
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