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參數(shù)資料
| 型號： | XA1000 |
| 廠商： | Mimix Broadband, Inc. |
| 英文描述： | DC-18.0 GHz GaAs MMIC 5-Bit Digital Attenuator |
| 中文描述： | 直流18.0千兆赫的GaAs MMIC 5位數(shù)字衰減器 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 427K |
| 代理商： | XA1000 |
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1.347
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2.376
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1.550
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1.747
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Mechanical Drawing
(Note: Engineering designator is I0005359)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.28 mg.
DC-18.0 GHz GaAs MMIC
5-Bit Digital Attenuator
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
Bond Pad #1 (RF In)
Bond Pad #2 (Input 1)
Bond Pad #3 (Input 2)
Bond Pad #4 (Input 3)
Bond Pad #5 (
V
ss)
Bond Pad #6 (Input 4)
Bond Pad #7 (Input 5)
Bond Pad #8 (RF Out)
Bias Arrangement
Bypass Capa
c
itors
- See App
N
ote [2]
A1000
April 2006 - Rev 24-Apr-06
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