參數(shù)資料
型號: X9261TS24
廠商: Intersil
文件頁數(shù): 12/20頁
文件大?。?/td> 0K
描述: IC DCP DUAL 100K 256TP 24SOIC
標(biāo)準(zhǔn)包裝: 30
系列: XDCP™
接片: 256
電阻(歐姆): 100k
電路數(shù): 2
溫度系數(shù): 標(biāo)準(zhǔn)值 ±300 ppm/°C
存儲器類型: 非易失
接口: 6 線 SPI(芯片選擇,設(shè)備位址)
電源電壓: 4.5 V ~ 5.5 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 24-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 24-SOIC
包裝: 管件
2
FN8171.4
October 12, 2006
DETAILED FUNCTIONAL DIAGRAM
CIRCUIT LEVEL APPLICATIONS
Vary the gain of a voltage amplifier
Provide programmable dc reference voltages for
comparators and detectors
Control the volume in audio circuits
Trim out the offset voltage error in a voltage ampli-
fier circuit
Set the output voltage of a voltage regulator
Trim the resistance in Wheatstone bridge circuits
Control the gain, characteristic frequency and
Q-factor in filter circuits
Set the scale factor and zero point in sensor signal
conditioning circuits
Vary the frequency and duty cycle of timer ICs
Vary the dc biasing of a pin diode attenuator in RF
circuits
Provide a control variable (I, V, or R) in feedback
circuits
Ordering Information
PART NUMBER
PART
MARKING
VCC LIMITS
(V)
RTOTAL (kΩ) TEMP RANGE (°C)
PACKAGE
PKG.
DWG. #
X9261US24
X9261US
5 ±10%
50
0 to 70
24 Ld SOIC (300 mil)
M24.3
X9261US24Z (Note)
X9261US Z
0 to 70
24 Ld SOIC (300 mil) (Pb-free)
M24.3
X9261UV24
X9261UV
0 to 70
24 Ld TSSOP (4.4mm)
MDP0044
X9261UV24Z (Note)
X9261UV Z
0 to 70
24 Ld TSSOP (4.4mm) (Pb-free)
MDP0044
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
R0 R1
R2 R3
Wiper
Counter
Register
(WCR)
Resistor
Array
Pot 1
RH1
RL1
R0 R1
R2 R3
Wiper
Counter
Register
(WCR)
RH0 RL0
Data
8
RW0
RW1
Pot 0
INTERFACE
AND
CONTROL
CIRCUITRY
VCC
VSS
256-taps
50k
Ω and 100kΩ
CS
SCK
A0
SO
SI
HOLD
WP
A1
Power-on
Recall
Power-on
Recall
X9261
相關(guān)PDF資料
PDF描述
MS3450W22-19PX CONN RCPT 14POS WALL MNT W/PINS
X9260US24 IC DCP DUAL 50K 256TP 24SOIC
X9260TS24 IC DCP DUAL 100K 256TP 24SOIC
MS3450W22-19PW CONN RCPT 14POS WALL MNT W/PINS
X9259US24I-2.7 IC DCP QUAD 50K 256TP 24SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
X9261TS24-2.7 功能描述:IC XDCP DUAL 256TAP 100K 24-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:2,500 系列:XDCP™ 接片:256 電阻(歐姆):100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 ±300 ppm/°C 存儲器類型:非易失 接口:I²C(設(shè)備位址) 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)
X9261TS24-2.7T1 功能描述:IC XDCP DUAL 256TAP 100K 24-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:2,500 系列:XDCP™ 接片:256 電阻(歐姆):100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 ±300 ppm/°C 存儲器類型:非易失 接口:I²C(設(shè)備位址) 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)
X9261TS24I 功能描述:IC XDCP DUAL 256TAP 100K 24-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:2,500 系列:XDCP™ 接片:256 電阻(歐姆):100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 ±300 ppm/°C 存儲器類型:非易失 接口:I²C(設(shè)備位址) 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)
X9261TS24I-2.7 功能描述:IC XDCP DUAL 256TAP 100K 24-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:2,500 系列:XDCP™ 接片:256 電阻(歐姆):100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 ±300 ppm/°C 存儲器類型:非易失 接口:I²C(設(shè)備位址) 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)
X9261TS24I-2.7T1 功能描述:IC XDCP DUAL 256TAP 100K 24-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)字電位器 系列:XDCP™ 標(biāo)準(zhǔn)包裝:2,500 系列:XDCP™ 接片:256 電阻(歐姆):100k 電路數(shù):1 溫度系數(shù):標(biāo)準(zhǔn)值 ±300 ppm/°C 存儲器類型:非易失 接口:I²C(設(shè)備位址) 電源電壓:2.7 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:14-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:14-TSSOP 包裝:帶卷 (TR)