參數(shù)資料
型號: X9251
廠商: Intersil Corporation
英文描述: Single Supply/Low Power/256-Tap/SPI Bus
中文描述: 單電源/低Power/256-Tap/SPI巴士
文件頁數(shù): 23/25頁
文件大小: 549K
代理商: X9251
X9251
Characteristics subject to change without notice.
23 of 25
REV 1.3.3 2/10/04
www.xicor.com
PACKAGING INFORMATION
24-Bump Chip Scale Package (CSP B24)
Package Outline Drawing
Symbol
A
B
C
D
E
F
J
K
L
M
Millimeters
Nom.
2.785
4.537
0.677
0.457
0.220
0.320
0.5
0.5
0.643
1.081
Inches
Nom.
Min
2.755
4.507
0.644
0.444
0.200
0.300
Max
2.815
4.567
0.710
0.470
0.240
0.340
Min
Max
Package Width
Package Length
Package Height
Body Thickness
Ball Height
Ball Diameter
Ball Pitch – Width
Ball Pitch – Length
Ball to Edge Spacing – Width
Ball to Edge Spacing – Length
0.618
1.056
0.668
1.106
Ball Matrix
4
3
2
1
A
R
L1
R
W1
A1
CS
R
W0
R
L0
B
SI
WP
C
VSS
R
H1
R
H2
R
H0
R
H3
VCC
D
NC
NC
E
R
W2
R
L2
HOLD
SO
R
L3
R
W3
F
SCK
A0
9
Y
L
f
k
m
l
j
b
a
A4
A3
A2
A1
A4
A3
A2
A1
A4
A3
A2
A1
A4
A3
A2
A1
A4
A3
A2
A1
A4
A3
A2
A1
e
d
e
e
Top View (Marking Side)
Bottom View (Bumped Side)
Side View
Side View
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