2
FN8165.3
August 29, 2006
Ordering Information
PART NUMBER
PART
MARKING
VCC LIMITS (V)
POTENTIOMETER
ORGANIZATION (k
)
TEMP. RANGE
(°C)
PACKAGE
PKG. DWG. #
X9250TS24I
X9250TS I
5 ±10%
100
-40 to +85
24 Ld SOIC (300 mil)
M24.3
X9250TS24IZ (Note)
X9250TS ZI
-40 to +85
24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9250TV24I
X9250TV I
-40 to +85
24 Ld TSSOP
(4.4mm)
MDP0044
X9250TV24IZ (Note)
X9250TV ZI
-40 to +85
24 Ld TSSOP
(4.4mm) (Pb-free)
MDP0044
X9250US24
X9250US
50
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9250US24Z (Note)
X9250US Z
0 to +70
24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9250US24I
X9250US I
-40 to +85
24 Ld SOIC (300 mil)
M24.3
X9250US24IZ (Note)
X9250US ZI
-40 to +85
24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9250UV24I
X9250UV I
-40 to +85
24 Ld TSSOP
(4.4mm)
MDP0044
X9250UV24IZ (Note)
X9250UV ZI
-40 to +85
24 Ld TSSOP
(4.4mm) (Pb-free)
MDP0044
X9250TS24-2.7
X9250TS F
-2.7 to 5.5
100
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9250TS24Z-2.7 (Note)
X9250TS ZF
0 to +70
24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9250TS24I-2.7*
X9250TS G
-40 to +85
24 Ld SOIC (300 mil)
M24.3
X9250TS24IZ-2.7*
(Note)
X9250TS ZG
-40 to +85
24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9250TV24I-2.7
X9250TV G
-40 to +85
24 Ld TSSOP
(4.4mm)
MDP0044
X9250TV24IZ-2.7 (Note) X9250TV ZG
-40 to +85
24 Ld TSSOP
(4.4mm) (Pb-free)
MDP0044
X9250US24-2.7*
X9250US F
50
0 to +70
24 Ld SOIC (300 mil)
M24.3
X9250US24Z-2.7* (Note) X9250US ZF
0 to +70
24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9250US24I-2.7
X9250US G
-40 to +85
24 Ld SOIC (300 mil)
M24.3
X9250US24IZ-2.7 (Note) X9250US ZG
-40 to +85
24 Ld SOIC (300 mil)
(Pb-free)
M24.3
X9250UV24-2.7
X9250UV F
0 to +70
24 Ld TSSOP
(4.4mm)
MDP0044
X9250UV24Z-2.7 (Note) X9250UV ZF
0 to +70
24 Ld TSSOP
(4.4mm) (Pb-free)
MDP0044
X9250UV24I-2.7
X9250UV G
-40 to +85
24 Ld TSSOP
(4.4mm)
MDP0044
X9250UV24IZ-2.7 (Note) X9250UV ZG
-40 to +85
24 Ld TSSOP
(4.4mm) (Pb-free)
MDP0044
*Add "T1" suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
X9250