型號(hào): | X28C64TMB-20 |
英文描述: | 5 Volt, Byte Alterable E2PROM |
中文描述: | 5伏,可變E2PROM的字節(jié) |
文件頁(yè)數(shù): | 18/25頁(yè) |
文件大?。?/td> | 110K |
代理商: | X28C64TMB-20 |
相關(guān)PDF資料 |
PDF描述 |
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X28C64TMB-25 | 5 Volt, Byte Alterable E2PROM |
X28C64DM-15 | 5 Volt, Byte Alterable E2PROM |
X28C64DM-20 | 5 Volt, Byte Alterable E2PROM |
X28C64DM-25 | 5 Volt, Byte Alterable E2PROM |
X28C64FM-15 | 5 Volt, Byte Alterable E2PROM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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X28C64TMB-25 | 制造商:XICOR 制造商全稱:Xicor Inc. 功能描述:5 Volt, Byte Alterable E2PROM |
X28F00AH33EF95C | 制造商:Micron Technology Inc 功能描述:X28F00AH33EF95C - Trays |
X28F024M180F96C | 制造商:Micron Technology Inc 功能描述:WIRELESS 制造商:Micron Technology Inc 功能描述:WIRELESS - Gel-pak, waffle pack, wafer, diced wafer on film |
X28F024M181F96C | 制造商:Micron Technology Inc 功能描述:WIRELESS 制造商:Micron Technology Inc 功能描述:WIRELESS - Gel-pak, waffle pack, wafer, diced wafer on film |
X28F128M180F96C | 制造商:Micron Technology Inc 功能描述:WIRELESS 制造商:Micron Technology Inc 功能描述:WIRELESS - Gel-pak, waffle pack, wafer, diced wafer on film |