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參數(shù)資料
| 型號： | WS512K32V-15G2UCA |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQFP68 |
| 封裝： | 22.40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68 |
| 文件頁數(shù)： | 6/7頁 |
| 文件大小： | 292K |
| 代理商： | WS512K32V-15G2UCA |
6
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WS512K32V-XXX
March
2006
Rev. 12
27.3 (1.075) ± 0.25 (0.010) SQ
PIN 1 IDENTIFIER
SQUARE PAD
ON BOTTOM
25.4 (1.0) TYP
0.46 (0.018) ± 0.05 (0.002) DIA
1.42 (0.056) ± 0.13 (0.005)
0.76 (0.030) ± 0.13 (0.005)
1.27 (0.050) TYP DIA
25.4 (1.0) TYP
15.24 (0.600) TYP
2.54 (0.100)
TYP
3.81 (0.150)
± 0.13 (0.005)
4.60 (0.181)
MAX
PACKAGE 510: 68 LEAD, LOW PROFILE CERAMIC QUAD FLAT PACK, CQFP (G2U)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.38 (0.015) ± 0.05 (0.002)
0.25 (0.010) ± 0.10 (0.002)
25.15 (0.990) ± 0.25 (0.010) SQ
1.27 (0.050) TYP
24.0 (0.946)
± 0.25 (0.010)
22.36 (0.880) ± 0.25 (0.010) SQ
20.3 (0.800) REF
23.87
(0.940) REF
1.01 (0.040)
± 0.13 (0.005)
0.25 (0.010) REF
1° / 7°
R 0.25
(0.010)
DETAIL A
SEE DETAIL "A"
Pin 1
0.53 (0.021)
± 0.18 (0.007)
3.51 (0.140) MAX
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32V-15G2UI | 制造商:White Electronic Designs 功能描述:Res Thin Film 0603 35.7 Ohm 0.25% 1/16W ±10ppm/°C Molded SMD Paper T/R 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 3.3V, 15NS, 68 CQFP 0.88" SQ., 0.140" - Bulk |
| WS512K32V-15G2UM | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 3.3V, 15NS, 68 CQFP 0.88" SQ., 0.140" - Bulk |
| WS512K32V-15H1C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32V-15H1CA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32V-15H1I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
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