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參數(shù)資料
| 型號： | WS512K32NV-17H1C |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CHIP66 |
| 封裝： | CERAMIC, HIP-66 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 105K |
| 代理商： | WS512K32NV-17H1C |
7
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WS512K32V-XXX
PACKAGE 509: 68 LEAD, LOW PROFILE CERAMIC QUAD FLAT PACK, CQFP (G2T)
0.38 (0.015)
± 0.05 (0.002)
0.27 (0.011)
± 0.04 (0.002)
25.15 (0.990)
± 0.26 (0.010) SQ
1.27 (0.050) TYP
24.03 (0.946)
± 0.26 (0.010)
22.36 (0.880)
± 0.26 (0.010) SQ
20.3 (0.800) REF
4.57 (0.180) MAX
0.19 (0.007)
± 0.06 (0.002)
23.87
(0.940) REF
1.0 (0.040)
± 0.127 (0.005)
0.25 (0.010) REF
1
° / 7°
R 0.25
(0.010)
DETAIL A
SEE DETAIL "A"
Pin 1
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.940"
TYP
The WEDC 68 lead G2T CQFP
fills the same fit and function as
the JEDEC 68 lead CQFJ or 68
PLCC. But the G2T has the TCE
and lead inspection advantage
of the CQFP form.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS512K32V-17G2TMA | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 |
| WS512K32NV-70HIA | 512K X 32 MULTI DEVICE SRAM MODULE, 70 ns, CHIP66 |
| WS512K32NV-100HIA | 512K X 32 MULTI DEVICE SRAM MODULE, 100 ns, CHIP66 |
| WS512K32NV-70HCA | 512K X 32 MULTI DEVICE SRAM MODULE, 70 ns, CHIP66 |
| WS512K32V-85G2TQ | 512K X 32 STANDARD SRAM, 85 ns, CQFP68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32NV-17H1CA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32NV-17H1I | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 3.3V, 17NS, NO CONNECT, 66 PGA 1.075" - Bulk |
| WS512K32NV-17H1IA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
| WS512K32NV-17H1M | 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 3.3V, 17NS, NO CONNECT, 66 PGA 1.075" - Bulk |
| WS512K32NV-17H1MA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:512Kx32 SRAM 3.3V MODULE |
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