參數(shù)資料
型號: WS512K32N-55H1QA
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66
封裝: 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件頁數(shù): 8/11頁
文件大小: 577K
代理商: WS512K32N-55H1QA
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32-XXX
May 2006
Rev. 17
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
4.60 (0.181)
MAX
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not
Recommended
For New Design
PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1
相關(guān)PDF資料
PDF描述
WS512K32N-45H1Q 512K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CPGA66
WS512K32N-17H1Q 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66
WS512K32-17G2LCA 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68
WS512K32-55G4TIA 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68
WS512K32N-25H1C 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66
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