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參數(shù)資料
| 型號(hào)： | WS512K32-55NH1CA |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, HMA66 |
| 封裝： | CERAMIC, HIP-66 |
| 文件頁數(shù)： | 8/10頁 |
| 文件大小： | 142K |
| 代理商： | WS512K32-55NH1CA |
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WS512K32-XXX
PACKAGE 509: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2T)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
The White 68 lead G2T CQFP
fills the same fit and function as
the JEDEC 68 lead CQFJ or 68
PLCC. But the G2T has the TCE
and lead inspection advantage
of the CQFP form.
0.940"
TYP
0.38 (0.015)
± 0.05 (0.002)
0.27 (0.011)
± 0.04 (0.002)
25.15 (0.990)
± 0.26 (0.010) SQ
1.27 (0.050) TYP
24.03 (0.946)
± 0.26 (0.010)
22.36 (0.880)
± 0.26 (0.010) SQ
20.3 (0.800) REF
4.57 (0.180) MAX
0.19 (0.007)
± 0.06 (0.002)
23.87
(0.940) REF
1.0 (0.040)
± 0.127 (0.005)
0.25 (0.010) REF
1
° / 7°
R 0.25
(0.010)
DETAIL A
SEE DETAIL "A"
Pin 1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS512K32-55NH1M | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66 |
| WS512K32-20NH1CA | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| WS512K32-55HSI | 2M X 8 MULTI DEVICE SRAM MODULE, 55 ns, CHIP66 |
| WS512K32N-120HC | 2M X 8 MULTI DEVICE SRAM MODULE, 120 ns, CHIP66 |
| WS512K32N-25HSM | 2M X 8 MULTI DEVICE SRAM MODULE, 25 ns, CHIP66 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32-70G2I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-70G2M | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-70G2Q | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-70G2TC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MODULE, SMD 5962-94611 |
| WS512K32-70G2TCA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MODULE, SMD 5962-94611 |
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