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參數資料
| 型號： | WS512K32-55G4TM |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
| 封裝： | CERAMIC, QFP-68 |
| 文件頁數： | 10/10頁 |
| 文件大小： | 150K |
| 代理商： | WS512K32-55G4TM |
9
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WS512K32-XXX
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55
°C to +125°C
I = Industrial
-40
°C to 85°C
C = Commercial
0
°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2T = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509)
G4T = 40mm Low Profile CQFP (Package 502)
G1U = 22.4mm Low Profile CQFP (Package 519)
ACCESS TIME (ns)
IMPROVEMENT MARK:
N = No Connect at pin 21 and 39 in HIP for Upgrades
Blank = Standard Power
L = Low Power Data Retention
ORGANIZATION, 512Kx32
User configurable as 1Mx16 or 2Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S
512K 32 X - XXX X X X
相關PDF資料 |
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| WS512K32-25G1UI | 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68 |
| WS512K32-17G1UQA | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 |
| WS512K32L-20H1MA | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CHIP66 |
| WS512K32L-20H1Q | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CHIP66 |
| WS512K32N-17H1M | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CHIP66 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| WS512K32-55G4TMA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-55G4TQ | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM|512KX32|CMOS|QFL|68PIN|CERAMIC |
| WS512K32-55G4TQA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-70G2I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-70G2M | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
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