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參數(shù)資料
| 型號： | WS512K32-55G2LIA |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
| 封裝： | 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 |
| 文件頁數(shù)： | 2/11頁 |
| 文件大?。?/td> | 577K |
| 代理商： | WS512K32-55G2LIA |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32-XXX
May 2006
Rev. 17
Document Title
512K x 32 SRAM Multi-Chip Package
Revision History
Rev # History
Release Date
Status
Initial
October 1996
Preliminary
Change (Pg. 1, 3)
January 1997
Preliminary
1.1 Change Operation Supply Current from 520mA To 540mA
1.2 Change Data Retention Current from 12mA to 28mA.
Change (Pg. 1, 2, 8, 10, 11)
November 1997
Preliminary
1.1 Delete G2 Package
Change (Pg. 1, 9)
February 1998
Preliminary
1.1 Add SMD Case Outline M for G2T
Change (Pg. 1, 3, 8)
April 1998
Preliminary
1.1 Remove Low Capacitance package option
Change (Pg. 1, 6, 8)
December 1998
Preliminary
1.1 Add H1 package
Change (Pg. 1, 4, 6, 9, 10)
March 1999
Preliminary
1.1 Remove H2 package
1.2 Change logo to WEDC logo
Rev 2
Change (Pg. 1, 3, 4, 8)
May 1999
Final
1.1 Change status from Preliminary to Final
1.2 Make package descriptions consistent
1.3 Add 15ns as available in Commercial and Industrial Temperatures only.
Rev 4
Change (Pg. 1, 3)
June 1999
Final
1.1 Change Standby Current (Isb) from 60mA to 80mA Maximum
Rev 5
Change (Pg. 1, 2, 3, 4, 7, 8)
November 1999
Final
1.1 Add G1U package
Rev 6
Change (Pg. 1, 8)
February 2000
Final
1.1 Change G1U lead foot length from 0.64mm to 0.84mm Ref
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32-55G2M | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-55G2Q | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-55G2TC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM|512KX32|CMOS|QFP|68PIN|CERAMIC |
| WS512K32-55G2TCA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-55G2TI | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM|512KX32|CMOS|QFP|68PIN|CERAMIC |
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