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參數(shù)資料
| 型號： | WS512K32-35H1C |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CPGA66 |
| 封裝： | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件頁數(shù)： | 10/11頁 |
| 文件大?。?/td> | 577K |
| 代理商： | WS512K32-35H1C |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32-XXX
May 2006
Rev. 17
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55°C to +125°C
I = Industrial
-40°C to 85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G4T1 = 40mm Low Prole CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
Blank = Standard Power
N = No Connect at pin 21 and 39 in HIP for Upgrades
L = Low Power Data Retention
ORGANIZATION, 512Kx32
User congurable as 1Mx16 or 2Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S 512K 32 X - XXX X X X
Note 1: Package Not Recommended For New Design
ORDERING INFORMATION
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS512K32-20H1QA | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| WS512K32-20H1CA | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| WS512K32-15G2LM | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQFP68 |
| WS512K32L-55H1MA | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66 |
| WS512K32L-55G2LC | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
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| WS512K32-45G2I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-45G2M | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-45G2Q | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-45G2TC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-45G2TCA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM|512KX32|CMOS|QFP|68PIN|CERAMIC |
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