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參數(shù)資料
| 型號(hào)： | WS512K32-35G2LQ |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類(lèi)： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68 |
| 封裝： | 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 |
| 文件頁(yè)數(shù)： | 10/11頁(yè) |
| 文件大小： | 577K |
| 代理商： | WS512K32-35G2LQ |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32-XXX
May 2006
Rev. 17
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55°C to +125°C
I = Industrial
-40°C to 85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G4T1 = 40mm Low Prole CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
Blank = Standard Power
N = No Connect at pin 21 and 39 in HIP for Upgrades
L = Low Power Data Retention
ORGANIZATION, 512Kx32
User congurable as 1Mx16 or 2Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S 512K 32 X - XXX X X X
Note 1: Package Not Recommended For New Design
ORDERING INFORMATION
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS512K32-20G2UC | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
| WS512K32-25G4TI | 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68 |
| WS512K32N-55G2LQ | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
| WS512K32N-20G2LCA | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
| WS512K32N-17G4TIA | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32-35G2M | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:x32 SRAM Module |
| WS512K32-35G2Q | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:x32 SRAM Module |
| WS512K32-35G2TC | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:x32 SRAM Module |
| WS512K32-35G2TCA | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:SRAM|512KX32|CMOS|QFP|68PIN|CERAMIC |
| WS512K32-35G2TI | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:x32 SRAM Module |
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