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參數(shù)資料
| 型號(hào)： | WS512K32-25G2UMA |
| 廠(chǎng)商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類(lèi)： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68 |
| 封裝： | 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 |
| 文件頁(yè)數(shù)： | 3/11頁(yè) |
| 文件大?。?/td> | 577K |
| 代理商： | WS512K32-25G2UMA |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32-XXX
May 2006
Rev. 17
Rev 7
Change (Pg. 1, 3, 9)
October 2000
Final
1.1 Change Operating Supply Current from 540mA to 660mA Maximum
1.2 Add Low Power Data Retention Current of 16mA to Data Retention Characteristics table
1.3 Add Low Power Data Retention (L) option to Ordering Information
Rev 8
Change (Pg. 1, 2, 6, 7, 9, 10)
October 2001
Final
1.1 Change G2T and G4T package status to Not Recommended For New Design
Rev 9
Change (Pg. 1, 2, 3, 8, 9, 10)
November 2001
Final
1.1 Add G1T package
1.2 Remove ‘Hi-Reliability Product’ Title
Rev 10
Change (Pg. 1, 2, 3, 4, 7, 8, 9, 10, 11)
August 2002
Final
1.1 Remove G2T package
1.2 Add G2U package
1.3 Remove ‘Package to be Developed’ note for G4T
Rev 11
Change (Pg. 1,2,4,8,10,11,13)
February 2002
Final
1.1 Change G1U package status to Not Recommended For New Designs
Rev 12
Change (Pg. 1,2,3,7,8,10,11,13)
May 2003
Final
1.1 Add G2L package
Rev 13
Change (Pg. 1,2,3,7,8,10,11,13)
December 2003
Final
1.1 Remove all reference to G1U package
1.2 Remove all reference to G1T package
Rev 14
Change (Pg. 1,3,11)
May 2004
Final
1.1 Change IOL to 6mA for 15-35 ns
Rev 15
Change (Pg. 1,4,11)
November 2004
Final
1.1 Add 15ns for Military Temperature
Rev 16
Change (Pg. 1, 6, 11)
1.1 Correct thickness to 0.181"per PCN#140A00143
March 2006
Final
Rev 17
Change ( Pg. 1, 2, 11)
May 2006
Final
1.1 Correct pinout of G4T
1.2 Correct G2L foot length
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS512K32L-20G4TI | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
| WS512K32L-20G4TCA | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
| WS512K32N-55H1QA | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66 |
| WS512K32N-45H1Q | 512K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CPGA66 |
| WS512K32N-17H1Q | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32-25G4TC | 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:SRAM|512KX32|CMOS|QFL|68PIN|CERAMIC |
| WS512K32-25G4TCA | 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:x32 SRAM Module |
| WS512K32-25G4TI | 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:SRAM|512KX32|CMOS|QFL|68PIN|CERAMIC |
| WS512K32-25G4TIA | 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:x32 SRAM Module |
| WS512K32-25G4TM | 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:x32 SRAM Module |
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