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參數(shù)資料
| 型號(hào)： | WS256K32L-25HC |
| 元件分類(lèi)： | SRAM |
| 英文描述： | 256K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CHIP66 |
| 封裝： | CERAMIC, HIP-66 |
| 文件頁(yè)數(shù)： | 1/7頁(yè) |
| 文件大?。?/td> | 173K |
| 代理商： | WS256K32L-25HC |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WS256K32-XXX
HI-RELIABILITY PRODUCT
256Kx32 SRAM MODULE PRELIMINARY*
FEATURES
s Access Times 20, 25, 35ns
s MIL-STD-883 Compliant Devices Available
s Packaging
66 pin, PGA Type, 1.185 inch square, Hermetic
Ceramic HIP (Package 401)
68 lead, 40mm, Hermetic CQFP (Package 501)
s Organized as 256Kx32, User Configurable as 512Kx16
s Upgradable to 512Kx32 for future expansion
s Data I/O Compatible with 3.3V devices
s 2V Data Retention devices available
(WS256K32L-XXX low power version only)
s Commercial, Industrial and Military Temperature Range
s 5 Volt Power Supply
s Low Power CMOS
s TTL Compatible Inputs and Outputs
s Weight
WS256K32N-XHX - 13 grams typical
WS256K32-XG4X - 20 grams typical
*
This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
FIG. 1 PIN CONFIGURATION FOR WS256K32N-XHX
I/O8
I/O9
I/O10
A13
A14
A15
A16
A17
I/O0
I/O1
I/O2
NC
GND
I/O11
A10
A11
A12
VCC
CS1
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE
NC
WE1
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A6
A7
NC
A8
A9
I/O16
I/O17
I/O18
VCC
NC
I/O27
A3
A4
A5
WE2
CS2
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A0
A1
A2
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
BLOCK DIAGRAM
TOP VIEW
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-17
Address Inputs
WE1-2
Write Enables
CS1-2
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
256K x 16
16
I/O 0-15
CS1
256K x 16
16
I/O 16-31
2
A 0-17
OE
WE
CS
WE
12
October 2000 Rev. 2
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS256K32-25G4M | 256K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68 |
| WS256K32-20HCA | 256K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CHIP66 |
| WS256K32L-20G4M | 256K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
| WS256K32L-35HCA | 256K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CHIP66 |
| WS256K32L-35HIA | 256K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CHIP66 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS256K32L-25HCA | 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:256Kx32 SRAM MODULE |
| WS256K32L-25HI | 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:256Kx32 SRAM MODULE |
| WS256K32L-25HIA | 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:256Kx32 SRAM MODULE |
| WS256K32L-25HM | 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:256Kx32 SRAM MODULE |
| WS256K32L-25HMA | 制造商:未知廠(chǎng)家 制造商全稱(chēng):未知廠(chǎng)家 功能描述:256Kx32 SRAM MODULE |
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