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參數(shù)資料
| 型號(hào)： | WS1M32V-17G3I |
| 元件分類： | SRAM |
| 英文描述： | 1M X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP84 |
| 封裝： | 28 MM, CERAMIC, QFP-84 |
| 文件頁(yè)數(shù)： | 1/6頁(yè) |
| 文件大小： | 155K |
| 代理商： | WS1M32V-17G3I |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
HI-RELIABILITY PRODUCT
WS1M32V-XG3X
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
9
VCC
A0
A1
A2
A3
A4
A5
A6
OE1
OE2
OE3
OE4
NC
A7
A8
A9
A10
A11
A12
A13
GND
V
CC
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
CS
1
NC
CS
2
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
GND
NC
WE4
WE3
WE2
WE1
NC
A18
A17
A16
A15
A14
VCC
GND
I/O
31
I/O
3
0
I/O
2
9
I/O
2
8
I/O
2
7
I/O
2
6
I/O
2
5
I/O
2
4
NC
I/O
2
3
I/O
22
I/O
21
I/O
2
0
I/O
1
9
I/O
1
8
I/O
1
7
I/O
1
6
V
CC
876543
1 84 83 82 81 80 79 78 77
2
37 38 39 40 41 42 43
45 46 47 48 49 50 51 52 53
44
76 75
11 10
33
34 35 36
1Mx32 SRAM 3.3V MODULE PRELIMINARY*
FEATURES
s Access Times of 17, 20, 25ns
s 84 lead, 28mm CQFP, (Package 511)
s Organized as two banks of 512Kx32, User Configurable as
2Mx16 or 4Mx8
s Commercial and Industrial Temperature Ranges
s TTL Compatible Inputs and Outputs
s 3.3 Volt Power Supply
PIN CONFIGURATION FOR WS1M32V-XG3X
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE1-4
Write Enables
CS1-2
Chip Selects
OE1-4
Output Enables
VCC
+3.3V Power Supply
GND
Ground
NC
Not Connected
TOP VIEW
s Low Power CMOS
s Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
s Weight
WS1M32V-XG3X - 20 grams typical
* This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
March 2000 Rev. 4
BLOCK DIAGRAM
8
I/O 0-7
CS1
I/O 8-15
CS2
I/O 16-23
I/O 24-31
A 0-18
WE 1
8
2M x 8
8
512K x 8
8
512K x 8
2M x 8
512K x 8
2M x 8
512K x 8
2M x 8
512K x 8
OE1
WE 2
OE2
WE 3
OE3
WE 4
OE4
NOTE: CS1& CS2 are used as bank select
The WEDC 84 lead G3 CQFP fills
the same fit and function as the
JEDEC 84 lead CQFJ or 84 PLCC.
But the G3 has the TCE and lead
inspection advantage of the
CQFP form.
1.146"
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS1M32V-17G3IA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-17G3M | 制造商:Microsemi Corporation 功能描述:1M X 32 SRAM MODULE, - Bulk |
| WS1M32V-17G3MA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-20G3C | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-20G3CA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
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