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參數(shù)資料
| 型號： | WS1M32-20G3IA |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | SRAM |
| 英文描述： | 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP84 |
| 封裝： | 28 X 28 MM, CERAMIC, QFP-84 |
| 文件頁數(shù)： | 1/3頁 |
| 文件大?。?/td> | 363K |
| 代理商： | WS1M32-20G3IA |
WS1M32-XG3X
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
January, 2007
Rev. 5
1Mx32 SRAM MODULE
FEATURES
Access Times of 17, 20, 25ns
Packaging
84 lead, 28mm CQFP, (Package 511)
Organized as two banks of 512Kx32, User
Congurable as 2Mx16 or 4Mx8
Commercial, Industrial and Military Temperature
Ranges
TTL Compatible Inputs and Outputs
5V Power Supply
Low Power CMOS
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WS1M32-XG3X - 20 grams (typical)
This product is subject to change without notice.
PIN CONFIGURATION FOR WS1M32-XG3X
TOP VIEW
BLOCK DIAGRAM
8
I/O0-7
CS#1
I/O8-15
CS#2
I/O16-23
I/O24-31
A0-18
WE#1
8
2M x 8
8
512K x 8
8
512K x 8
2M x 8
512K x 8
2M x 8
512K x 8
2M x 8
512K x 8
OE#1
WE#2
OE#2
WE#3
OE#3
WE#4
OE#4
Note: CS#1& CS#2 are used as bank select
1.146"
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
9
VCC
A0
A1
A2
A3
A4
A5
A6
OE#1
OE#2
OE#3
OE#4
NC
A7
A8
A9
A10
A11
A12
A13
GND
V
CC
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
CS#
1
NC
CS#
2
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
GND
NC
WE#4
WE#3
WE#2
WE#1
NC
A18
A17
A16
A15
A14
VCC
GND
I/O
31
I/O
30
I/O
29
I/O
28
I/O
27
I/O
26
I/O
25
I/O
24
NC
I/O
23
I/O
22
I/O
21
I/O
20
I/O
19
I/O
18
I/O
17
I/O
16
V
CC
876543
1 84 83 82 81 80 79 78 77
2
37
38 39 40 41 42 43
45 46 47 48 49 50 51 52 53
44
76 75
11
10
33
34 35 36
The WEDC 84 lead G3 CQFP lls the same t and function as the JEDEC 84 lead CQFJ
or 84 PLCC. But the G3 has the TCE and lead inspection advantage of the CQFP form.
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE#1-4
Write Enables
CS#1-2
Chip Selects
OE#1-4
Output Enables
VCC
Power Supply
GND
Ground
NC
Not Connected
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS1M32-17H2IA | 1M X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 |
| WS1M32-17H2C | 1M X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 |
| WS1M32-17H2C | 1M X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 |
| WS1M32-17H2MA | 1M X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 |
| WS1M32-20G4TI | 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS1M32-20G3M | 制造商:Microsemi Corporation 功能描述:1M X 32 SRAM MODULE, 5V, 20NS, 84 CQFP 1.285" SQ., MIL-SCREE - Bulk 制造商:White Electronic Designs 功能描述:1M X 32 SRAM MODULE, 5V, 20NS, 84 CQFP 1.285" SQ., MIL-SCREE - Bulk |
| WS1M32-20G3MA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:1Mx32 SRAM MODULE |
| WS1M32-20G4TI | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS1M32-20G4TM | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS1M32-20HSC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:1Mx32 SRAM MODULE |
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