參數(shù)資料
型號: WS128K32NV-35H1C
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: SRAM
英文描述: 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CPGA66
封裝: 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件頁數(shù): 8/8頁
文件大?。?/td> 462K
代理商: WS128K32NV-35H1C
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32V-XXX
March 2006
Rev. 8
W S 128K 32 X V - XXX X X X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
M = Military Screened
-55°C to +125°C
I = Industrial -40°C to +85°C
C = Commercial 0°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, Low Prole CQFP (Package 510)
ACCESS TIME (ns)
LOW VOLTAGE SUPPLY 3.3V ± 10%
IMPROVEMENT MARK:
N = No Connect at pins 8, 21, 28, 39 in HIP for upgrade. (H1 only)
ORGANIZATION, 128Kx32
User congurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
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WS128K32NV-35H1CA 制造商:未知廠家 制造商全稱:未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32NV-35H1I 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 3.3V, 35NS, NO CONNECT, 66 PGA 1.075" - Bulk
WS128K32NV-35H1IA 制造商:未知廠家 制造商全稱:未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE
WS128K32NV-35H1M 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 3.3V, 35NS, NO CONNECT, 66 PGA 1.075" - Bulk
WS128K32NV-35H1MA 制造商:未知廠家 制造商全稱:未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE