參數(shù)資料
型號(hào): WS128K32N-55H1QA
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: SRAM
英文描述: 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66
封裝: 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件頁(yè)數(shù): 8/9頁(yè)
文件大小: 494K
代理商: WS128K32N-55H1QA
8
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WS128K32-XXX
May 2006
Rev. 17
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G4T1 = 40 mm Low Prole CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrades
L = Low Power*
ORGANIZATION, 128Kx32
User congurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORPORATION
ORDERING INFORMATION
W S 128K 32 X - XXX X X X
* Low Power Data Retention only available in G2U, G2L, PackageTypes
Note 1: Package Not Recommended For New Designs
相關(guān)PDF資料
PDF描述
WS128K32N-55H1C 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66
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