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參數(shù)資料
| 型號(hào)： | WS128K32N-55H1MA |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66 |
| 封裝： | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件頁(yè)數(shù)： | 8/9頁(yè) |
| 文件大?。?/td> | 494K |
| 代理商： | WS128K32N-55H1MA |
8
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WS128K32-XXX
May 2006
Rev. 17
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G4T1 = 40 mm Low Prole CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrades
L = Low Power*
ORGANIZATION, 128Kx32
User congurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORPORATION
ORDERING INFORMATION
W S 128K 32 X - XXX X X X
* Low Power Data Retention only available in G2U, G2L, PackageTypes
Note 1: Package Not Recommended For New Designs
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS128K32N-55H1M | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66 |
| WS128K32N-55H1QA | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66 |
| WS128K32N-55H1C | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66 |
| WS128K32L-55G2UM | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
| WS128K32L-55G2LMA | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS128K32N-55H1Q | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS128K32N-55HI | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS128K32N-55HM | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS128K32N-55HQ | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS128K32N-70G2UC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MODULE, SMD 5962-93187 |
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