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參數(shù)資料
| 型號： | WS128K32N-55H1C |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66 |
| 封裝： | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件頁數(shù)： | 6/9頁 |
| 文件大?。?/td> | 494K |
| 代理商： | WS128K32N-55H1C |
6
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WS128K32-XXX
May 2006
Rev. 17
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
4.60 (0.181)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not
Recommended
For New Design
PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS128K32L-55G2UM | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
| WS128K32L-55G2LMA | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
| WS128K32L-55G2LC | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
| WS128K32N-70HIE | 512K X 8 MULTI DEVICE SRAM MODULE, 70 ns, CHIP66 |
| WS128K32-70G4IE | 512K X 8 MULTI DEVICE SRAM MODULE, 70 ns, CQFP68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS128K32N-55H1I | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 5V, 55NS, NO CONNECT, 66 PGA 1.075" S - Bulk |
| WS128K32N-55H1M | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 5V, 55NS, NO CONNECT, 66 PGA 1.075" S - Bulk |
| WS128K32N-55H1Q | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS128K32N-55HI | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS128K32N-55HM | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
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