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參數(shù)資料
| 型號： | WS128K32N-35G2TCE |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68 |
| 封裝： | 22.4 X 22.4 MM, CERAMIC, QFP-68 |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 383K |
| 代理商： | WS128K32N-35G2TCE |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32-XG2TXE
December 2000
Rev. 0
ADVANCED
ORDERING INFORMATION
W S 128K 32 X - XXX X X E X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
E = Epitaxial Layer on die
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55°C to +125°C
I = Industrial -40°C to +85°C
C = Commercial 0°C to +70°C
PACKAGE TYPE:
G2T = 22.4mm Ceramic Quad Flat Pack, Low Prole CQFP (Package 510)
ACCESS TIME (ns)
IMPROVEMENT MARK:
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrades
ORGANIZATION, 128Kx32
User congurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORPORATION
* Low Power Data Retention only available in G2T Package Type
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| WS128K32N-45G2TCEA | 128K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CQFP68 |
| WS128K32N-55H1MA | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66 |
| WS128K32N-55H1M | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66 |
| WS128K32N-55H1QA | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS128K32N-35G2TCEA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35G2TIE | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35G2TIEA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35G2TME | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
| WS128K32N-35G2TMEA | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT |
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