參數(shù)資料
型號(hào): WS128K32N-15H1I
元件分類(lèi): SRAM
英文描述: 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CHIP66
封裝: HERMETIC SEALED, CERAMIC, HIP-66
文件頁(yè)數(shù): 8/9頁(yè)
文件大?。?/td> 156K
代理商: WS128K32N-15H1I
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55
°C to +125°C
I = Industrial
-40
°C to +85°C
C = Commercial
0
°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400)
G2T = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509)
G1U = 22.4mm Ceramic Quad Flat Pack, Low Provile CQFP (Package 519)
G4T = 40 mm Low Profile CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrades
L = Low Power
ORGANIZATION, 128Kx32
User configurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORPORATION
W S
128K 32 X - XXX X X X
WS128K32-XXX
相關(guān)PDF資料
PDF描述
WS128K32N-25H1IA 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CHIP66
WS128K32N-55H1M 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CHIP66
WS128K32-35G1UMA 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68
WS128K32-35G2TCA 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68
WS128K32-45G1UC 128K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CQFP68
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