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參數(shù)資料
| 型號(hào)： | WS128K32-55G4TM |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
| 封裝： | 40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68 |
| 文件頁數(shù)： | 11/11頁 |
| 文件大?。?/td> | 375K |
| 代理商： | WS128K32-55G4TM |
9
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32-XXX
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1= 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G1U1 = 23.9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 519)
G1T = 23.9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 524)
G4T1 = 40 mm Low Profile CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrades
L = Low Power*
ORGANIZATION, 128Kx32
User configurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORPORATION
ORDERING INFORMATION
W S
128K 32 X - XXX X X X
* Low Power Data Retention only available in G2U, G2L, G1U, G1T PackageTypes
Note 1: Package Not Recommended For New Designs
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