參數(shù)資料
型號: WF1M32B-100HC3
廠商: WHITE ELECTRONIC DESIGNS CORP
元件分類: PROM
英文描述: 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CPGA66
封裝: 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件頁數(shù): 3/13頁
文件大?。?/td> 481K
代理商: WF1M32B-100HC3
11
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specications without notice.
PACKAGE 509: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2T)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.38 (0.015) ± 0.05 (0.002)
0.27 (0.011) ± 0.04 (0.002)
25.15 (0.990) ± 0.26 (0.010) SQ
1.27 (0.050) TYP
24.03 (0.946)
± 0.26 (0.010)
22.36 (0.880) ± 0.26 (0.010) SQ
20.3 (0.800) REF
4.57 (0.180) MAX
0.19 (0.007)
± 0.06 (0.002)
23.87
(0.940) REF
1.0 (0.040)
± 0.127 (0.005)
0.25 (0.010) REF
1
° / 7°
R 0.25
(0.010)
DETAIL A
SEE DETAIL "A"
Pin 1
The WEDC 68 lead G2T
CQFP lls the same t and
function as the JEDEC 68
lead CQFJ or 68 PLCC.
But the G2T has the TCE
and lead inspection advan-
tage of the CQFP form.
0.940"
相關(guān)PDF資料
PDF描述
WF1M32B-150G2TC3 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CQFP68
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WF1M32B-100G2TM3 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CQFP68
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